Inventor · disambiguated record
Vinod Kamath
Also filed as: KAMATH VINOD
67 granted patents·17 pending applications·1,974 citations·filing 1997–2024
99Inventor score
Files withIBM36LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD15CHAINER TIMOTHY J6KAMATH VINOD5LENOVO GLOBAL TECH UNITED STATES INC3
Top patents by PatentIndex Score
84 records- 0199US7639499B1Liquid cooling apparatus and method for facilitating cooling of an electronics systemIBM·Filed 2008·Granted Dec 29, 2009·128 cites·20 claims
- 0298US8789384B2Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchangerECKBERG ERIC A·Filed 2010·Granted Jul 29, 2014·67 cites·23 claims
- 0398US8493738B2Cooled electronic system with thermal spreaders coupling electronics cards to cold railsCHAINER TIMOTHY J·Filed 2011·Granted Jul 23, 2013·75 cites·13 claims
- 0498US7969736B1System for cooling memory modulesIBM·Filed 2010·Granted Jun 28, 2011·78 cites·18 claims
- 0598US7961475B2Apparatus and method for facilitating immersion-cooling of an electronic subsystemIBM·Filed 2008·Granted Jun 14, 2011·80 cites·20 claims
- 0698US7791882B2Energy efficient apparatus and method for cooling an electronics rackIBM·Filed 2008·Granted Sep 7, 2010·109 cites·20 claims
- 0797US8913384B2Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)DAVID MILNES P·Filed 2012·Granted Dec 16, 2014·47 cites·17 claims
- 0897US8687364B2Directly connected heat exchanger tube section and coolant-cooled structureCHAINER TIMOTHY J·Filed 2011·Granted Apr 1, 2014·33 cites·18 claims
- 0997US7957148B1Low profile computer processor retention deviceIBM·Filed 2009·Granted Jun 7, 2011·66 cites·14 claims
- 1097US7836314B2Computer system performance estimator and layout configuratorIBM·Filed 2006·Granted Nov 16, 2010·76 cites·16 claims
- 1197US7660109B2Apparatus and method for facilitating cooling of an electronics systemIBM·Filed 2007·Granted Feb 9, 2010·69 cites·19 claims
- 1297US7660116B2Rack with integrated rear-door heat exchangerIBM·Filed 2008·Granted Feb 9, 2010·110 cites·23 claims
- 1396US9668382B2Coolant distribution unit for a multi-node chassisLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2015·Granted May 30, 2017·16 cites·15 claims
- 1496US9414523B2Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic componentIBM·Filed 2013·Granted Aug 9, 2016·15 cites·8 claims
- 1596US9307674B2Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic componentCHAINER TIMOTHY J·Filed 2011·Granted Apr 5, 2016·18 cites·12 claims
- 1696US8649177B2Method of fabricating a cooled electronic systemCHAINER TIMOTHY J·Filed 2012·Granted Feb 11, 2014·28 cites·11 claims
- 1796US8638559B2User-serviceable liquid DIMM cooling systemBARINA RICHARD M·Filed 2011·Granted Jan 28, 2014·46 cites·19 claims
- 1896US8587943B2Liquid-cooling memory modules with liquid flow pipes between memory module socketsBARINA RICHARD M·Filed 2011·Granted Nov 19, 2013·49 cites·16 claims
- 1995US8385069B2Liquid coolant conduit secured in an unused socket for memory module coolingIBM·Filed 2010·Granted Feb 26, 2013·32 cites·16 claims
- 2095US7639486B2Rack system providing flexible configuration of computer systems with front accessIBM·Filed 2007·Granted Dec 29, 2009·58 cites·20 claims
- 2194US10111365B1Mounting electronic device to thermally conductive pad of liquid-cooling mechanism in translational movement-minimizing mannerLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2017·Granted Oct 23, 2018·13 cites·13 claims
- 2294US9179574B2Cooling unit for container-type data centerCANNEY BRIAN A·Filed 2011·Granted Nov 3, 2015·24 cites·18 claims
- 2394US9027360B2Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic systemCHAINER TIMOTHY J·Filed 2011·Granted May 12, 2015·27 cites·17 claims
- 2494US7342797B2Interposable heat sink for adjacent memory modulesIBM·Filed 2007·Granted Mar 11, 2008·29 cites·13 claims
- 2593US9936607B2Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreaderIBM·Filed 2014·Granted Apr 3, 2018·9 cites·9 claims
- 2693US9185830B2Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic systemIBM·Filed 2014·Granted Nov 10, 2015·12 cites·17 claims
- 2793US7289331B2Interposable heat sink for adjacent memory modulesIBM·Filed 2005·Granted Oct 30, 2007·23 cites·9 claims
- 2893US6227516B1Quick-release mechanism for hard disk driveIBM·Filed 1999·Granted May 8, 2001·87 cites·3 claims
- 2992US9930807B2Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreaderIBM·Filed 2014·Granted Mar 27, 2018·8 cites·10 claims
- 3092US6445580B1Adaptable heat dissipation device for a personal computerIBM·Filed 2000·Granted Sep 3, 2002·70 cites·11 claims
- 3189US8102651B2Airflow barriers for efficient cooling of memory modulesBLAND PATRICK M·Filed 2009·Granted Jan 24, 2012·22 cites·21 claims
- 3289US6817405B2Apparatus having forced fluid cooling and pin-fin heat sinkIBM·Filed 2002·Granted Nov 16, 2004·57 cites·8 claims
- 3388US7403393B2Apparatus and system for cooling heat producing componentsIBM·Filed 2005·Granted Jul 22, 2008·16 cites·20 claims
- 3487US12100959B2Overcooling an edge device that uses electrical energy from a local renewable energy systemLENOVO GLOBAL TECH UNITED STATES INC·Filed 2022·Granted Sep 24, 2024·1 cites·20 claims
- 3587US11058027B2Systems and methods for controlling air distribution to electronic componentsLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2019·Granted Jul 6, 2021·3 cites·16 claims
- 3687US7826215B2Ducted air temperature sensorIBM·Filed 2008·Granted Nov 2, 2010·17 cites·17 claims
- 3787US7612446B2Structures to enhance cooling of computer memory modulesIBM·Filed 2006·Granted Nov 3, 2009·16 cites·18 claims
- 3886US9132519B2Directly connected heat exchanger tube section and coolant-cooled structureIBM·Filed 2012·Granted Sep 15, 2015·5 cites·11 claims
- 3985US9089076B2Cooling system for electronicsCOX AARON R·Filed 2012·Granted Jul 21, 2015·10 cites·23 claims
- 4084US12369271B2Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic componentLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2022·Granted Jul 22, 2025·1 cites·17 claims
- 4184US8856321B2System to improve operation of a data center with heterogeneous computing cloudsIYENGAR MADHUSUDAN K·Filed 2011·Granted Oct 7, 2014·6 cites·19 claims
- 4284US7116555B2Acoustic and thermal energy management systemIBM·Filed 2003·Granted Oct 3, 2006·38 cites·20 claims
- 4383US9930806B2Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic componentIBM·Filed 2013·Granted Mar 27, 2018·3 cites·9 claims
- 4483US7529085B2Thermal docking fansinkLENOVO SINGAPORE PTE LTD·Filed 2006·Granted May 5, 2009·13 cites·8 claims
- 4582US6141216AQuick-release hinge joint for heat pipeIBM·Filed 1999·Granted Oct 31, 2000·49 cites·13 claims
- 4681US8255740B2Multi-level DIMM error reductionKAMATH VINOD·Filed 2010·Granted Aug 28, 2012·7 cites·20 claims
- 4780US10045463B2Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreaderIBM·Filed 2014·Granted Aug 7, 2018·2 cites·11 claims
- 4879US7595986B2Controlling airflow in a computer chassisIBM·Filed 2007·Granted Sep 29, 2009·8 cites·13 claims
- 4978US8900503B2Method of forming an overmolded dual in-line memory module cooling structureBORAAS MICHAEL A·Filed 2011·Granted Dec 2, 2014·4 cites·9 claims
- 5078US8567483B2Heatsink with flexible base and height-adjusted cooling finsKAMATH VINOD·Filed 2009·Granted Oct 29, 2013·9 cites·16 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →