Inventor · disambiguated record
Vijendera Kumar
Also filed as: Kumar Vijendera
6 granted patents·2 citations·filing 2015–2019
67Inventor score
Top patents by PatentIndex Score
6 records- 0168US9986651B2Method for mitigating signal attenuation in printed circuit board connectionsDELL PRODUCTS LP·Filed 2015·Granted May 29, 2018·2 cites·20 claims
- 0256US10617003B2Method for manufacturing a surface mount technology (SMT) pad structure for next generation speedsDELL PRODUCTS LP·Filed 2019·Granted Apr 7, 2020·0 cites·14 claims
- 0354US10912190B2Electrical connector elementEMC IP HOLDING CO LLC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 0449US10405425B2Surface mount technology (SMT) pad design with differential contact strips having converging narrowing distal ends that facilitate high speed communicationDELL PRODUCTS LP·Filed 2017·Granted Sep 3, 2019·0 cites·14 claims
- 0540US11178751B2Printed circuit board having vias arranged for high speed serial differential pair data linksDELL PRODUCTS LP·Filed 2018·Granted Nov 16, 2021·0 cites·12 claims
- 0625US10430363B2Systems and methods of in-situ digital eye characterization for serial data transmitter circuitryWALLACE DOUG·Filed 2015·Granted Oct 1, 2019·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →