Inventor · disambiguated record
Vinay Pai
Also filed as: PAI VINAY · PAI VINAY S
4 granted patents·2 pending applications·18 citations·filing 2002–2024
67Inventor score
Top patents by PatentIndex Score
6 records- 0163US6683553B1Mechanism for transmitting from a sensor assembly to an acquisition system a message that includes self-describing informationSUN MICROSYSTEMS INC·Filed 2002·Granted Jan 27, 2004·14 cites·20 claims
- 0259US2025254915A1Robust backside contact formationIBM·Filed 2024·Application pending·0 cites
- 0358US2025294847A1Direct backside contact integration with thick silicon layerIBM·Filed 2024·Application pending·0 cites
- 0457US11947712B2Secure identification of wafer and chipIBM·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 0552US12254992B2Contact tracing utilizing device signatures captured during transactionsIBM·Filed 2021·Granted Mar 18, 2025·0 cites·15 claims
- 0648US7058931B2Dynamically configurable unit conversion mechanismSUN MICROSYSTEMS INC·Filed 2002·Granted Jun 6, 2006·4 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →