Inventor · disambiguated record
Vincent P. Peterson
Also filed as: PETERSON III VINCENT P · PETERSON VINCENT P
9 granted patents·175 citations·filing 1996–2000
90Inventor score
Files withIBM9
Top patents by PatentIndex Score
9 records- 0189US6391669B1Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devicesIBM·Filed 2000·Granted May 21, 2002·71 cites·26 claims
- 0253US6261927B1Method of forming defect-free ceramic structures using thermally depolymerizable surface layerIBM·Filed 1999·Granted Jul 17, 2001·16 cites·19 claims
- 0352US5788808AApparatus for forming cavity substrates using compressive padsIBM·Filed 1997·Granted Aug 4, 1998·18 cites·17 claims
- 0450US6281692B1Interposer for maintaining temporary contact between a substrate and a test bedIBM·Filed 1998·Granted Aug 28, 2001·15 cites·10 claims
- 0548US6597058B1Method of forming defect-free ceramic structures using thermally depolymerizable surface layerIBM·Filed 1999·Granted Jul 22, 2003·12 cites·7 claims
- 0647US6255827B1Search routine for 2-point electrical testerIBM·Filed 1999·Granted Jul 3, 2001·14 cites·30 claims
- 0744US5759320AMethod of forming cavity substrates using compressive padsIBM·Filed 1997·Granted Jun 2, 1998·12 cites·18 claims
- 0843US5643818ARemoval of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chipIBM·Filed 1996·Granted Jul 1, 1997·11 cites·15 claims
- 0936US6423174B1Apparatus and insertless method for forming cavity substrates using coated membraneIBM·Filed 1996·Granted Jul 23, 2002·6 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →