Inventor · disambiguated record
Vijay Sarihan
Also filed as: SARIHAN VIJAY
13 granted patents·1 pending application·549 citations·filing 1995–2015
92Inventor score
Top patents by PatentIndex Score
14 records- 0196US6646347B2Semiconductor power device and method of formationMOTOROLA INC·Filed 2001·Granted Nov 11, 2003·137 cites·10 claims
- 0295US7145084B1Radiation shielded module and method of shielding microelectronic deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Dec 5, 2006·45 cites·10 claims
- 0394US6077726AMethod and apparatus for stress relief in solder bump formation on a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Jun 20, 2000·225 cites·13 claims
- 0486US6930032B2Under bump metallurgy structural design for high reliability bumped packagesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 16, 2005·43 cites·17 claims
- 0578US5515735AMicromachined flow sensor device using a pressure difference and method of manufacturing the sameMOTOROLA INC·Filed 1995·Granted May 14, 1996·46 cites·18 claims
- 0677US6888246B2Semiconductor power device with shear stress compensationFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted May 3, 2005·22 cites·9 claims
- 0772US9548280B2Solder pad for semiconductor device packageFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 17, 2017·3 cites·15 claims
- 0862US9818712B2Package with low stress region for an electronic componentFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Nov 14, 2017·1 cites·15 claims
- 0960US8080444B2Method for forming a packaged semiconductor device having a ground planeSARIHAN VIJAY·Filed 2010·Granted Dec 20, 2011·2 cites·10 claims
- 1059US6309908B1Package for an electronic component and a method of making itMOTOROLA INC·Filed 1999·Granted Oct 30, 2001·25 cites·10 claims
- 1146US9458012B2Method for shielding MEMS structures during front side wafer dicingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 4, 2016·0 cites·7 claims
- 1245US8148206B2Package for high power integrated circuits and method for formingSARIHAN VIJAY·Filed 2009·Granted Apr 3, 2012·0 cites·20 claims
- 1339US9359192B1Microelectromechanical systems (MEMS) devices with control circuits and methods of fabricationFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
- 1436US2007200253A1Electronic assembly and method for forming the sameGOGOI BISHNU P·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →