Inventor · disambiguated record
Vivek Swaminathan Sridharan
Also filed as: SRIDHARAN VIVEK · SRIDHARAN VIVEK S · SRIDHARAN VIVEK SWAMINATHAN
16 granted patents·6 pending applications·93 citations·filing 2011–2024
91Inventor score
Files withTEXAS INSTRUMENTS INC14MAXIM INTEGRATED PRODUCTS5GEORGIA TECH RES INST1KHANDEKAR VIREN1SUNDARAM VENKATESH1
Top patents by PatentIndex Score
22 records- 0192US9275934B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameSUNDARAM VENKATESH·Filed 2011·Granted Mar 1, 2016·43 cites·17 claims
- 0290US11380637B2Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 5, 2022·2 cites·23 claims
- 0389US9000587B1Wafer-level thin chip integrationMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Apr 7, 2015·11 cites·20 claims
- 0488US10672718B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameGEORGIA TECH RES INST·Filed 2016·Granted Jun 2, 2020·6 cites·18 claims
- 0588US9721912B2Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionalityMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Aug 1, 2017·10 cites·12 claims
- 0685US10134689B1Warpage compensation metal for wafer level packaging technologyMAXIM INTEGRATED PRODUCTS·Filed 2016·Granted Nov 20, 2018·5 cites·19 claims
- 0782US10804233B1Wafer-level chip-scale package device having bump assemblies configured to maintain standoff heightKHANDEKAR VIREN·Filed 2011·Granted Oct 13, 2020·10 cites·12 claims
- 0879US2025029943A1Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0973US12142586B2Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·0 cites·22 claims
- 1073US11984418B2Method of forming brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2022·Granted May 14, 2024·0 cites·13 claims
- 1173US8878350B1Semiconductor device having a buffer material and stiffenerMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Nov 4, 2014·3 cites·20 claims
- 1270US10056294B2Techniques for adhesive control between a substrate and a dieMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Aug 21, 2018·3 cites·10 claims
- 1367US11978709B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2022·Granted May 7, 2024·0 cites·23 claims
- 1462US11362047B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1561US11410947B2Brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 1657US11854922B2Semicondutor package substrate with die cavity and redistribution layerTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 26, 2023·0 cites·24 claims
- 1756US11855024B2Wafer chip scale packages with visible solder filletsTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 26, 2023·0 cites·22 claims
- 1854US2024363462A1Efficient redistribution layer topology for high-power semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1951US2023317673A1Fan out flip chip semiconductor packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2049US2024297112A1Passive component moduleTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2147US2024145363A1Fan-out package having ball grid array substrate with signal and power metallizationTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2245US2021210462A1Chip scale package with redistribution layer interruptsTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →