Inventor · disambiguated record
Volkmar Senz
Also filed as: SENZ VOLKMAR
17 granted patents·3 pending applications·15 citations·filing 2005–2023
87Inventor score
Files withBOSCH GMBH ROBERT20
Top patents by PatentIndex Score
20 records- 0185US11486782B2Micromechanical device and method for manufacturing a micromechanical deviceBOSCH GMBH ROBERT·Filed 2018·Granted Nov 1, 2022·4 cites·9 claims
- 0279US11933689B2MEMS capacitive sensor including improved contact separationBOSCH GMBH ROBERT·Filed 2020·Granted Mar 19, 2024·1 cites·15 claims
- 0374US11060937B2Micromechanical pressure sensorBOSCH GMBH ROBERT·Filed 2018·Granted Jul 13, 2021·2 cites·9 claims
- 0471US7647832B2Micromechanical device and method for producing a micromechanical deviceBOSCH GMBH ROBERT·Filed 2006·Granted Jan 19, 2010·6 cites·8 claims
- 0569US11976996B2Micromechanical component for a capacitive pressure sensor deviceBOSCH GMBH ROBERT·Filed 2019·Granted May 7, 2024·1 cites·5 claims
- 0663US11215509B2Method for determining a temperature without contact, and infrared measuring systemBOSCH GMBH ROBERT·Filed 2017·Granted Jan 4, 2022·1 cites·19 claims
- 0758US2025388456A1Micromechanical pressure sensor having at least two membranes for determining a pressure value, and corresponding methodBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 0853US12448280B2Bond structures on MEMS element and ASIC elementBOSCH GMBH ROBERT·Filed 2019·Granted Oct 21, 2025·0 cites·15 claims
- 0950US2025102385A1Micromechanical pressure sensor, method for producing same, and method for detecting a pressure variableBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 1049US12460981B2Micromechanical component for a capacitive pressure sensor device, capacitive pressure sensor device, and a manufacturing method for a capacitive pressure sensor deviceBOSCH GMBH ROBERT·Filed 2021·Granted Nov 4, 2025·0 cites·11 claims
- 1149US11441964B2Micromechanical pressure sensor device and corresponding manufacturing methodBOSCH GMBH ROBERT·Filed 2018·Granted Sep 13, 2022·0 cites·9 claims
- 1248US12030773B2Method for producing a wafer connectionBOSCH GMBH ROBERT·Filed 2019·Granted Jul 9, 2024·0 cites·16 claims
- 1348US11940345B2Micromechanical component for a capacitive pressure sensor deviceBOSCH GMBH ROBERT·Filed 2019·Granted Mar 26, 2024·0 cites·25 claims
- 1442US10442681B2Micromechanical system including a sensitive element and associated manufacturing methodBOSCH GMBH ROBERT·Filed 2018·Granted Oct 15, 2019·0 cites·15 claims
- 1538US9778323B2Magnetic sensor device and manufacturing method for a magnetic sensor deviceBOSCH GMBH ROBERT·Filed 2014·Granted Oct 3, 2017·0 cites·5 claims
- 1637US9923015B2Infrared photosensorBOSCH GMBH ROBERT·Filed 2013·Granted Mar 20, 2018·0 cites·12 claims
- 1737US9850120B2Micromechanical component having a diaphragmBOSCH GMBH ROBERT·Filed 2013·Granted Dec 26, 2017·0 cites·19 claims
- 1835US7667282B2Micromechanical component and method for manufacturing such a componentBOSCH GMBH ROBERT·Filed 2005·Granted Feb 23, 2010·0 cites·11 claims
- 1935US2019154510A1Method for Determining a Temperature without Contact and Infrared Measuring SystemBOSCH GMBH ROBERT·Filed 2017·Application pending·0 cites
- 2034US10816404B2Method for determining a temperature without contact, and infrared measuring systemBOSCH GMBH ROBERT·Filed 2017·Granted Oct 27, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →