Inventor · disambiguated record
Volker Strutz
Also filed as: STRUTZ VOLKER
44 granted patents·4 pending applications·148 citations·filing 2000–2024
97Inventor score
Top patents by PatentIndex Score
48 records- 0197US11835600B2Current sensorINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 5, 2023·3 cites·20 claims
- 0291US9741677B1Semiconductor device including antistatic die attach materialINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 22, 2017·7 cites·11 claims
- 0389US11385301B2Sensor devices having a sensor chip and busbarINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0487US7688592B2Cooling system for devices having power semiconductors and method for cooling the deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 30, 2010·23 cites·25 claims
- 0584US6724076B1Package for a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 20, 2004·45 cites·9 claims
- 0681US12366615B2Current sensor that includes a current rail and a magnetic field sensor with galvanic isolationINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 0781US6851598B2Electronic component with a semiconductor chip and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 8, 2005·27 cites·25 claims
- 0879US11326910B2Sensor package and method for producing a sensor packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 10, 2022·1 cites·19 claims
- 0978US7355858B2Heat sink for surface-mounted semiconductor devices and mounting methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 8, 2008·9 cites·16 claims
- 1077US10438878B2Package with component connected with carrier via spacer particlesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 8, 2019·2 cites·15 claims
- 1176US11662232B2Sensor package and method for producing a sensor packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted May 30, 2023·0 cites·20 claims
- 1276US9391263B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·2 cites·18 claims
- 1372US9523720B2Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signalINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 20, 2016·3 cites·22 claims
- 1471US9111772B1Electronic array and chip packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 18, 2015·3 cites·25 claims
- 1570US11726148B2Sensor devices having soft magnets and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 1669US8860153B2Semiconductor packages, systems, and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2012·Granted Oct 14, 2014·2 cites·41 claims
- 1768US11895930B2Current sensor package with continuous insulationINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 6, 2024·0 cites·19 claims
- 1866US12381381B2Sensor devices with busbar and sensor chip and dielectrics arranged therebetweenINFINEON TECHNOLOGIES AG·Filed 2022·Granted Aug 5, 2025·0 cites·25 claims
- 1965US11493538B2Sensor devices with sensor chip and busbarINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 2063US11561245B2Sensor apparatuses with a bypass current path and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 24, 2023·0 cites·18 claims
- 2163US9728493B2Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 8, 2017·1 cites·20 claims
- 2262US9658296B2Current sensor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 23, 2017·1 cites·24 claims
- 2362US9553208B2Current sensor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 24, 2017·1 cites·19 claims
- 2461US2025192005A1Semiconductor devices including rounded components and related manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2559US2024153885A1Semiconductor devices with electrical insulation features and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2658US11211551B2Current sensor package with continuous insulationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 28, 2021·0 cites·16 claims
- 2758US9608201B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 28, 2017·0 cites·18 claims
- 2857US2017148981A1Semiconductor Devices Having Insulating Substrates and Methods of Formation ThereofINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 2956US11094619B2Package with component connected with carrier via spacer particlesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 3056US8969985B2Semiconductor chip package and methodSTRUTZ VOLKER·Filed 2011·Granted Mar 3, 2015·1 cites·20 claims
- 3155US10304795B2Semiconductor device including antistatic die attach materialINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 3252US8722514B2Semiconductor devices having insulating substrates and methods of formation thereofVON KOBLINSKI CARSTEN·Filed 2011·Granted May 13, 2014·0 cites·19 claims
- 3352US6815613B2Electronic component with external connection elementsTECHNOLOGIES AG·Filed 2001·Granted Nov 9, 2004·8 cites·29 claims
- 3451US11391791B2Sensor device with auxiliary structure for calibrating the sensor deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 19, 2022·0 cites·21 claims
- 3550US10515879B2Package with component connected at carrier levelINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 24, 2019·0 cites·18 claims
- 3650US6903932B2Covering element for subassembliesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 7, 2005·4 cites·15 claims
- 3749US7804178B2Semiconductor component with surface mountable devices and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 28, 2010·0 cites·12 claims
- 3847US10505102B2Semiconductor device for sensing a magnetic field including an encapsulation material defining a through-holeINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 10, 2019·0 cites·16 claims
- 3947US7998797B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 16, 2011·0 cites·25 claims
- 4047US7825506B2Semiconductor module including semiconductor chips in a plastic housing in separate regionsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 2, 2010·0 cites·22 claims
- 4146US9504143B2Electrical circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 22, 2016·0 cites·27 claims
- 4245US6927487B2Protective device with spacer for subassembliesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 9, 2005·2 cites·16 claims
- 4344US8026618B2Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shapeINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 27, 2011·0 cites·14 claims
- 4443US7235873B2Protective device for subassemblies and method for producing a protective deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 26, 2007·1 cites·12 claims
- 4538US9013890B2Semiconductor packages and methods for producing the sameAUSSERLECHNER UDO·Filed 2012·Granted Apr 21, 2015·0 cites·24 claims
- 4638US8071433B2Semiconductor component with surface mountable devices and method for producing the sameSYRI ERICH·Filed 2010·Granted Dec 6, 2011·0 cites·7 claims
- 4735US2003025187A1Protective device for subassembliesFiled 2002·Application pending·0 cites
- 4830US6436731B2Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing materialINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 20, 2002·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →