Inventor · disambiguated record
W. Bottoms
Also filed as: BOTTOMS W R
0 granted patents·3 pending applications·0 citations·filing 2007–2011
Top patents by PatentIndex Score
3 records- 0143US2007245553A1Fine pitch microfabricated spring contact structure & methodCHONG FU C·Filed 2007·Application pending·0 cites
- 0242US2012023730A1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesCHONG FU CHIUNG·Filed 2011·Application pending·0 cites
- 0336US2012212248A9Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card AssembliesCHONG FU CHIUNG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →