Inventor · disambiguated record
Wallace H. Ables
Also filed as: ABLES WALLACE · ABLES WALLACE H · ABLES WALLACE HUSON
7 granted patents·5 pending applications·37 citations·filing 1991–2024
78Inventor score
Top patents by PatentIndex Score
12 records- 0188US10736216B1Non-rectangular connection pad for improved electrical characteristics on tracesDELL PRODUCTS LP·Filed 2019·Granted Aug 4, 2020·3 cites·20 claims
- 0273US2024341040A1Printed circuit board assembly process using multiple solders and assembled boards made using the sameDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 0368US9867295B2Ball grid array systemDELL PRODUCTS LP·Filed 2014·Granted Jan 9, 2018·2 cites·8 claims
- 0468US5196070AThermally stable water soluble solder flux and pasteIBM·Filed 1991·Granted Mar 23, 1993·31 cites·20 claims
- 0568US2025122409A1Protective masking tape for circuit board tabsDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 0662US9678137B2System and method to monitor contact joint integrityMUTNURY BHYRAV M·Filed 2014·Granted Jun 13, 2017·1 cites·20 claims
- 0758US12035483B2Printed circuit board assembly process using multiple solders and assembled boards made using the sameDELL PRODUCTS LP·Filed 2020·Granted Jul 9, 2024·0 cites·23 claims
- 0855US2025149487A1Solder preforms with embedded beads to act as standoffsDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 0953US2025151194A1Plated standoff feature for providing standoff between circuit board and circuit packageDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 1053US2025151191A1Dimple on circuit board for providing standoff between circuit board and circuit packageDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 1150US10750647B2Reducing displacement of selected components during printed circuit board assembly (PCBA) manufacturingDELL PRODUCTS LP·Filed 2017·Granted Aug 18, 2020·0 cites·16 claims
- 1238US10495566B2Circuits, systems and methods for corrosion detectionDELL PRODUCTS LP·Filed 2017·Granted Dec 3, 2019·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →