Inventor · disambiguated record

Warren L. Boyer

Also filed as: BOYER WARREN L

6 granted patents·19 citations·filing 2017–2019

76Inventor score

Technology areasH10W

Files withMICRON TECHNOLOGY INC6

Top patents by PatentIndex Score

6 records

0194US10483241B1Semiconductor devices with through silicon vias and package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 19, 2019·13 cites·21 claims
0287US10283462B1Semiconductor devices with post-probe configurabilityMICRON TECHNOLOGY INC·Filed 2017·Granted May 7, 2019·4 cites·10 claims
0371US10403585B2Semiconductor devices with post-probe configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 3, 2019·1 cites·11 claims
0469US10867991B2Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 15, 2020·1 cites·19 claims
0560US10811372B2Semiconductor devices with post-probe configurabilityMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 20, 2020·0 cites·10 claims
0656US11056467B2Semiconductor devices with through silicon vias and package-level configurabilityMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 6, 2021·0 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →