Inventor · disambiguated record
Wan-Yu Chiang
Also filed as: CHIANG WAN-YU
12 granted patents·6 pending applications·39 citations·filing 2014–2025
87Inventor score
Top patents by PatentIndex Score
18 records- 0183US12237320B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·16 claims
- 0283US12068303B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0383USD950341SCrimping toolHANLONG IND CO LTD·Filed 2020·Granted May 3, 2022·10 cites·1 claims
- 0482US12288730B2Semiconductor device, semiconductor package, and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 0582US2025316632A1Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0681US12381171B2Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 0776US2025210437A1Semiconductor device, semiconductor package, and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0875USD983634STube cutterHANLONG IND CO LTD·Filed 2021·Granted Apr 18, 2023·6 cites·1 claims
- 0974US11855058B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1071US11901256B2Semiconductor device, semiconductor package, and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 1170US11887955B2Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 1270USD847599SOpen-pass RJ45 modular plug crimperHANLONG IND CO LTD·Filed 2018·Granted May 7, 2019·13 cites·1 claims
- 1356USD760050SPlier toolHANLONG IND CO LTD·Filed 2014·Granted Jun 28, 2016·9 cites·1 claims
- 1456US2025236514A1Chemical stop structures for mems devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1552US2023014210A1Adjustable WrenchHANLONG IND CO LTD·Filed 2021·Application pending·0 cites
- 1643US2017373453A1Crimping ToolHANLONG IND CO LTD·Filed 2016·Application pending·0 cites
- 1739US2015295391A1StripperHANLONG IND CO LTD·Filed 2014·Application pending·0 cites
- 1836USD931699SCrimping baseHANLONG IND CO LTD·Filed 2019·Granted Sep 28, 2021·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →