Inventor · disambiguated record

Wan Gyan Choi

Also filed as: CHOI WAN GYAN

2 granted patents·311 citations·filing 1997–1997

71Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD2

Top patents by PatentIndex Score

2 records

0195US5900676ASemiconductor device package structure having column leads and a method for production thereofSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted May 4, 1999·264 cites·13 claims
0272US5894107AChip-size package (CSP) using a multi-layer laminated lead frameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 13, 1999·47 cites·9 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →