Inventor · disambiguated record
Wai Wong Chow
Also filed as: CHOW WAI W · CHOW WAI WONG
15 granted patents·2 pending applications·449 citations·filing 2002–2018
94Inventor score
Top patents by PatentIndex Score
17 records- 0195US6949816B2Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing sameMOTOROLA INC·Filed 2003·Granted Sep 27, 2005·129 cites·27 claims
- 0293US7033866B2Method for making dual gauge leadframeFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 25, 2006·33 cites·16 claims
- 0392US6667543B1Optical sensor packageMOTOROLA INC·Filed 2002·Granted Dec 23, 2003·83 cites·13 claims
- 0489US6917097B2Dual gauge leadframeFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 12, 2005·54 cites·7 claims
- 0587US7112871B2Flipchip QFN packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 26, 2006·19 cites·8 claims
- 0684US6867072B1Flipchip QFN package and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Mar 15, 2005·43 cites·22 claims
- 0780US6838751B2Multi-row leadframeFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 4, 2005·34 cites·13 claims
- 0877US10825757B2Semiconductor device and method with clip arrangement in IC packageNexperia BV·Filed 2016·Granted Nov 3, 2020·3 cites·16 claims
- 0973US7056766B2Method of forming land grid array packaged deviceFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jun 6, 2006·20 cites·25 claims
- 1066US6905910B1Method of packaging an optical sensorFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jun 14, 2005·14 cites·8 claims
- 1164US6958261B2Optical sensor packageFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Oct 25, 2005·11 cites·12 claims
- 1251US6875635B2Method of attaching a die to a substrateFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Apr 5, 2005·4 cites·6 claims
- 1347US10658274B2Electronic deviceNexperia BV·Filed 2018·Granted May 19, 2020·0 cites·14 claims
- 1445US6798074B2Method of attaching a die to a substrateMOTOROLA INC·Filed 2002·Granted Sep 28, 2004·2 cites·10 claims
- 1542US10269751B2Leadless package with non-collapsible bumpNexperia BV·Filed 2016·Granted Apr 23, 2019·0 cites·17 claims
- 1641US2005156301A1Method of packaging an optical sensorFiled 2005·Application pending·0 cites
- 1733US2002177254A1Semiconductor package and method for making the sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →