Inventor · disambiguated record
Walter Hartner
Also filed as: HARTNER WALTER
66 granted patents·17 pending applications·649 citations·filing 1997–2025
99Inventor score
Top patents by PatentIndex Score
83 records- 0198US8952521B2Semiconductor packages with integrated antenna and method of forming thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·90 cites·28 claims
- 0297US9583811B2Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compoundINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 28, 2017·41 cites·22 claims
- 0394US11824019B2Chip package with substrate integrated waveguide and waveguide interfaceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 21, 2023·4 cites·24 claims
- 0493US7468307B2Semiconductor structure and methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 23, 2008·28 cites·15 claims
- 0590US8669655B2Chip package and a method for manufacturing a chip packageGEITNER OTTMAR·Filed 2012·Granted Mar 11, 2014·26 cites·24 claims
- 0688US9910145B2Wireless communication system, a radar system and a method for determining a position information of an objectINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 6, 2018·7 cites·19 claims
- 0787US6043529ASemiconductor configuration with a protected barrier for a stacked cellSIEMENS AG·Filed 1999·Granted Mar 28, 2000·72 cites·7 claims
- 0886US7982284B2Semiconductor component including an isolation structure and a contact to the substrateINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 19, 2011·10 cites·15 claims
- 0985US11791529B2Radio-frequency devices and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 17, 2023·1 cites·21 claims
- 1084US12040543B2Radio-frequency devices and methods for producing radio-frequency devicesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 16, 2024·1 cites·20 claims
- 1183US10008470B2Embedded chip packages and methods for manufacturing an embedded chip packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 26, 2018·3 cites·17 claims
- 1281US6438019B2Ferroelectric random access memory (FeRAM) having storage capacitors with different coercive voltagesINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 20, 2002·29 cites·12 claims
- 1378US8912087B2Method of fabricating a chip packageHIRTREITER JOSEF·Filed 2012·Granted Dec 16, 2014·7 cites·25 claims
- 1478US6171934B1Recovery of electronic properties in process-damaged ferroelectrics by voltage-cyclingSYMETRIX CORP·Filed 1998·Granted Jan 9, 2001·39 cites·15 claims
- 1578US5962069AProcess for fabricating layered superlattice materials and AB03 type metal oxides without exposure to oxygen at high temperaturesSYMETRIX CORP·Filed 1997·Granted Oct 5, 1999·52 cites·26 claims
- 1676US6586348B2Method for preventing etching-induced damage to a metal oxide film by patterning the film after a nucleation anneal but while still amorphous and then thermally annealing to crystallizeINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jul 1, 2003·18 cites·3 claims
- 1773US6322849B2Recovery of electronic properties in hydrogen-damaged ferroelectrics by low-temperature annealing in an inert gasSYMETRIX CORP·Filed 1998·Granted Nov 27, 2001·33 cites·7 claims
- 1870US9721920B2Embedded chip packages and methods for manufacturing an embedded chip packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 1, 2017·2 cites·22 claims
- 1970US6503792B2Method for fabricating a patterned metal-oxide-containing layerINFINCON TECHNOLOGIES AG·Filed 2000·Granted Jan 7, 2003·17 cites·14 claims
- 2069US11879966B2Transmission of wireless signal having information on a local oscillator signalINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 23, 2024·0 cites·25 claims
- 2169US6559003B2Method of producing a ferroelectric semiconductor memoryINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 6, 2003·16 cites·20 claims
- 2266US9337159B2Semiconductor package with integrated microwave componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 10, 2016·1 cites·12 claims
- 2365US8637378B2Semiconductor component and methods for producing a semiconductor componentMEISER ANDREAS·Filed 2011·Granted Jan 28, 2014·1 cites·4 claims
- 2465US8476734B2Semiconductor component and methods for producing a semiconductor componentMEISER ANDREAS·Filed 2011·Granted Jul 2, 2013·1 cites·15 claims
- 2564US2024393433A1Method for authenticating an object, and mobile consumer deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2663US6649424B2Method for fabricating an integrated semiconductor circuit having a strongly polarizable dielectric or ferroelectricINFINEON TECHNOLOGIES AG·Filed 2002·Granted Nov 18, 2003·10 cites·17 claims
- 2762US2024312975A1Transformer arrangementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2861US6773986B2Method for fabricating a semiconductor memory deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 10, 2004·10 cites·25 claims
- 2960US12094842B2Semiconductor device having an antenna arranged over an active main surface of a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 17, 2024·0 cites·10 claims
- 3060US2024196757A1Fan-out wafer-level packages and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3160US2025160219A1Pad over active sensor cells integrated in a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3259US12438107B2High frequency devices including attenuating dielectric materialsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 7, 2025·0 cites·27 claims
- 3358US6649468B2Method for fabricating a microelectronic componentINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 18, 2003·8 cites·12 claims
- 3457US9275895B2Semiconductor component and methods for producing a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 1, 2016·0 cites·5 claims
- 3557US6858492B2Method for fabricating a semiconductor memory deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 22, 2005·8 cites·50 claims
- 3657US6323513B1Semiconductor component having at least one capacitor and methods for fabricating itINFINEON TECHNOLOGIES AG·Filed 1999·Granted Nov 27, 2001·18 cites·15 claims
- 3756US11764453B2RF devices including an RF chip having an electrical redistribution layer with RF antennas formed therein and methods of manufactureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 19, 2023·0 cites·25 claims
- 3856US9922946B2Method of manufacturing a semiconductor package having a semiconductor chip and a microwave componentINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 20, 2018·0 cites·20 claims
- 3956US6790676B2Method for producing a ferroelectric layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 14, 2004·7 cites·17 claims
- 4055US6730562B2Method of patterning ferroelectric layersINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 4, 2004·4 cites·36 claims
- 4154US9653426B2Method of manufacturing a semiconductor package having an integrated microwave componentINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 16, 2017·0 cites·7 claims
- 4254US2025016918A1Printed circuit board and method for mounting at least one semiconductor chip deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 4353US2024290729A1Semiconductor packages including shielding structuresINFINEON TECHOLOGIES AG·Filed 2024·Application pending·0 cites
- 4453US2018180730A1Transmission of wireless signal having information on a local oscillator signalINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 4552US2024030092A1Radio frequency devices including radio frequency absorbent featuresINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 4651US11251146B2Semiconductor devices having a non-galvanic connectionINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 4751US6051485AMethod of producing a platinum-metal pattern or structure by a lift-off processSIEMENS AG·Filed 1998·Granted Apr 18, 2000·13 cites·12 claims
- 4851US2017309582A1Semiconductor Devices with On-Chip Antennas and Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 4950US2024429177A1Radio frequency semiconductor device and method for fabricating a radio frequency semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 5049US6809019B2Method for producing a semiconductor structure, and use of the methodINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 26, 2004·4 cites·12 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →