Inventor · disambiguated record
Wataru Hidese
Also filed as: HIDESE WATARU
23 granted patents·480 citations·filing 1989–2011
96Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD18MIYAHARA SEIICHI2AWATA YOSHIAKI1KIHARA MASAHIRO1PANASONIC CORP1
Top patents by PatentIndex Score
23 records- 0194US6792676B2Apparatus and method for mounting electronic partsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 21, 2004·71 cites·13 claims
- 0289US5033185AElectronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Jul 23, 1991·53 cites·13 claims
- 0386US8327761B2Screen printerMIYAHARA SEIICHI·Filed 2011·Granted Dec 11, 2012·6 cites·2 claims
- 0486US6606790B2Component mounter and mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 19, 2003·28 cites·7 claims
- 0580US6865803B2Component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 15, 2005·19 cites·4 claims
- 0680US5208969AElectronic components mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted May 11, 1993·33 cites·7 claims
- 0778US8499688B2Screen printerMIYAHARA SEIICHI·Filed 2009·Granted Aug 6, 2013·6 cites·5 claims
- 0877US5342460AOuter lead bonding apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Aug 30, 1994·64 cites·9 claims
- 0976US8196287B2Electronic component installation apparatusAWATA YOSHIAKI·Filed 2009·Granted Jun 12, 2012·11 cites·5 claims
- 1074US8375852B2Screen printerPANASONIC CORP·Filed 2011·Granted Feb 19, 2013·2 cites·2 claims
- 1173US5113581AOuter lead bonding head and method of bonding outer leadMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted May 19, 1992·35 cites·7 claims
- 1269US6453548B1Electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 24, 2002·29 cites·5 claims
- 1369US5208975AMethod and apparatus for mounting electronic partsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted May 11, 1993·30 cites·3 claims
- 1467US6874225B2Electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 5, 2005·10 cites·25 claims
- 1565US9198336B2Electric component mounting system and electric component mounting methodKIHARA MASAHIRO·Filed 2006·Granted Nov 24, 2015·4 cites·8 claims
- 1660US6588096B1Method employing X-Y tables for simultaneously mounting electronic partsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 8, 2003·22 cites·9 claims
- 1757US7059043B2Method for mounting an electronic part by solder position detectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 13, 2006·5 cites·4 claims
- 1856US7137195B2Method for mounting electronic parts onto a boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 21, 2006·4 cites·5 claims
- 1956US6539622B2Electronic components mounting device and the mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 1, 2003·17 cites·6 claims
- 2052US6839960B2Method for mounting electronic parts on a boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 11, 2005·3 cites·6 claims
- 2151US7243420B2Electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 17, 2007·2 cites·10 claims
- 2249US5184397AElectrical component placing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Feb 9, 1993·13 cites·3 claims
- 2343US5338381AApparatus and method for bonding outer leadsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Aug 16, 1994·13 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →