Inventor · disambiguated record
Wan-Ling Hsiao
Also filed as: HSIAO WAN-LING
1 granted patent·3 pending applications·0 citations·filing 2021–2021
11Inventor score
Top patents by PatentIndex Score
4 records- 0160US12286511B2Loss-dissipation flexible copper clad laminate, manufacturing method thereof, and electronic deviceCPC CORP TAIWAN·Filed 2021·Granted Apr 29, 2025·0 cites·10 claims
- 0256US2023091989A1Diamine monomer compound, method for preparing the same, resin, flexible film, and electronic deviceZHEN DING TECH CO LTD·Filed 2021·Application pending·0 cites
- 0352US2023086746A1Diamine monomer compound, method for preparing the same, resin, flexible film, and electronic deviceZHEN DING TECH CO LTD·Filed 2021·Application pending·0 cites
- 0442US2022056213A1Loss-dissipation flexible copper clad laminate, manufacturing method thereof, and electronic deviceUNIV NAT CHUNG HSING·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →