Inventor · disambiguated record
Wan-Jung Hsieh
Also filed as: HSIEH WAN-JUNG
4 granted patents·1 pending application·29 citations·filing 2005–2008
72Inventor score
Top patents by PatentIndex Score
5 records- 0185US7564123B1Semiconductor package with fastened leadsPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Jul 21, 2009·16 cites·20 claims
- 0273US7619307B1Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the packagePOWERTECH TECHNOLOGY INC·Filed 2008·Granted Nov 17, 2009·7 cites·14 claims
- 0373US7446160B2Phosphorus-containing cured benzoxazine resins and preparation thereofUNIV NAT CHENG KUNG·Filed 2005·Granted Nov 4, 2008·6 cites·28 claims
- 0447US7812430B2Leadframe and semiconductor package having downset baffle paddlesPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Oct 12, 2010·0 cites·18 claims
- 0542US2009236710A1Col semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →