Inventor · disambiguated record
Wangyong Im
Also filed as: IM WANGYONG
2 granted patents·3 pending applications·0 citations·filing 2023–2025
25Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0172US2025342872A1Semiconductor memory device and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0257US12380935B2Semiconductor memory device and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·18 claims
- 0356US12265488B2Apparatus and method for die-to-die (D2D) interconnectsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 0452US2025062303A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0550US2024371831A1Semiconductor apparatus using both surfaces of a wafer and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →