Inventor · disambiguated record
Wataru Kasai
Also filed as: KASAI WATARU
20 granted patents·12 pending applications·11 citations·filing 2013–2024
89Inventor score
Top patents by PatentIndex Score
32 records- 0184US11370200B2Fluororesin film and laminate, and method for producing hot pressed laminateAGC INC·Filed 2019·Granted Jun 28, 2022·1 cites·15 claims
- 0282US9613832B2Mold release film and process for producing semiconductor packageASAHI GLASS CO LTD·Filed 2016·Granted Apr 4, 2017·4 cites·13 claims
- 0376US12466927B2Roll film, method for producing roll film, method for producing copper-clad laminate and method for producing printed boardAGC INC·Filed 2024·Granted Nov 11, 2025·0 cites·6 claims
- 0476US10304583B2Insulating tape for covering, and method for producing structureAGC INC·Filed 2015·Granted May 28, 2019·1 cites·9 claims
- 0575US10141204B2Film, method for its production, and method for producing semiconductor element using the filmASAHI GLASS CO LTD·Filed 2017·Granted Nov 27, 2018·2 cites·15 claims
- 0672US2021040252A1Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit boardAGC INC·Filed 2020·Application pending·0 cites
- 0767US12083767B2Long film, method for producing long film, method for producing long multilayer body, and long multilayer bodyAGC INC·Filed 2021·Granted Sep 10, 2024·0 cites·15 claims
- 0867US10699916B2Mold release film, process for its production, and process for producing semiconductor packageAGC INC·Filed 2017·Granted Jun 30, 2020·1 cites·13 claims
- 0966US2023227684A1Powder dispersion and method for producing compositeAGC INC·Filed 2023·Application pending·0 cites
- 1065US10844153B2Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit boardAGC INC·Filed 2017·Granted Nov 24, 2020·0 cites·12 claims
- 1164US12119142B2Film, method for producing film, metal-clad laminate, and coated metal conductorAGC INC·Filed 2022·Granted Oct 15, 2024·0 cites·14 claims
- 1262US9859133B2Mold release film and process for producing semiconductor packageASAHI GLASS CO LTD·Filed 2016·Granted Jan 2, 2018·1 cites·18 claims
- 1360US9306135B2Mold release film and method of process for producing a semiconductor device using the sameASAHI GLASS CO LTD·Filed 2014·Granted Apr 5, 2016·1 cites·15 claims
- 1460US2020407524A1Roll film, method for producing roll film, method for producing copper-clad laminate and method for producing printed boardAGC INC·Filed 2020·Application pending·0 cites
- 1559US11632859B2Long laminate, method for its production and printed wiring boardAGC INC·Filed 2020·Granted Apr 18, 2023·0 cites·9 claims
- 1657US2020113048A1Method for producing laminated body, laminated body and method for producing flexible printed circuit boardAGC INC·Filed 2019·Application pending·0 cites
- 1756US11535015B2Molded product, metal-clad laminate, printed wiring board, and methods for their productionAGC INC·Filed 2020·Granted Dec 27, 2022·0 cites·14 claims
- 1856US10716203B2Adhesive film and flexible metal laminateAGC INC·Filed 2016·Granted Jul 14, 2020·0 cites·16 claims
- 1955US10729018B2Process for producing laminate and process for producing printed boardAGC INC·Filed 2018·Granted Jul 28, 2020·0 cites·13 claims
- 2055US2024307242A1Bed systemPARAMOUNT BED KK·Filed 2023·Application pending·0 cites
- 2152US10940629B2Ethylene-tetrafluoroethylene copolymer film and method for producing sameAGC INC·Filed 2018·Granted Mar 9, 2021·0 cites·12 claims
- 2250US10807776B2Resin film and process for its productionAGC INC·Filed 2018·Granted Oct 20, 2020·0 cites·13 claims
- 2350US2021024702A1Powder dispersion liquid, laminate, film, and impregnated woven fabricAGC INC·Filed 2020·Application pending·0 cites
- 2442US11978557B2Diagnosis support system and methodSPLINK INC·Filed 2019·Granted May 7, 2024·0 cites·30 claims
- 2542US2021296001A1Dementia risk presentation system and methodSPLINK INC·Filed 2019·Application pending·0 cites
- 2641US2014129221A1Sound recognition device, non-transitory computer readable storage medium stored threreof sound recognition program, and sound recognition methodDWANGO CO LTD·Filed 2013·Application pending·0 cites
- 2740US11098170B2Film and method for its productionAGC INC·Filed 2018·Granted Aug 24, 2021·0 cites·10 claims
- 2838US2023169648A1System, Control Method, Information Providing Method, and Recording MediumSPLINK INC·Filed 2021·Application pending·0 cites
- 2937US10913183B2Process for producing package for mounting a semiconductor element and mold release filmAGC INC·Filed 2016·Granted Feb 9, 2021·0 cites·18 claims
- 3036US2016368177A1Mold release film, process for its production and process for producing semiconductor packageASAHI GLASS CO LTD·Filed 2016·Application pending·0 cites
- 3136US2016368175A1Mold release film and process for producing sealed bodyASAHI GLASS CO LTD·Filed 2016·Application pending·0 cites
- 3233US2020092594A1Information processing device, information processing method, program, and information processing systemSONY NETWORK COMMUNICATIONS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →