Inventor · disambiguated record
Wahei Kitamura
Also filed as: KITAMURA WAHEI
15 granted patents·1 pending application·473 citations·filing 1987–2009
95Inventor score
Top patents by PatentIndex Score
16 records- 0195US5095626AMethod of producing semiconductor memory packagesHITACHI LTD·Filed 1989·Granted Mar 17, 1992·84 cites·35 claims
- 0292US4971196ASurface package type semiconductor packageHITACHI LTD·Filed 1989·Granted Nov 20, 1990·66 cites·19 claims
- 0389US4994411AProcess of producing semiconductor deviceHITACHI LTD·Filed 1989·Granted Feb 19, 1991·87 cites·15 claims
- 0486US5295297AMethod of producing semiconductor memoryHITACHI LTD·Filed 1992·Granted Mar 22, 1994·75 cites·27 claims
- 0584US4845543ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1987·Granted Jul 4, 1989·72 cites·26 claims
- 0670US7504315B2Method of transporting semiconductor device and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Mar 17, 2009·12 cites·16 claims
- 0767US7785986B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 31, 2010·2 cites·15 claims
- 0864US6443298B2Surface package type semiconductor package and method of producing semiconductor memoryHITACHI LTD·Filed 2001·Granted Sep 3, 2002·6 cites·29 claims
- 0960US7261207B2Method for carrying a semiconductor deviceHITACHI TRANSPORT SYSTEM·Filed 2004·Granted Aug 28, 2007·7 cites·8 claims
- 1060US5607059ASurface package type semiconductor package and method of producing semiconductor memoryHITACHI LTD·Filed 1994·Granted Mar 4, 1997·16 cites·87 claims
- 1159US6981585B2Surface package type semiconductor package and method of producing semiconductor memoryRENESAS TECH CORP·Filed 2002·Granted Jan 3, 2006·4 cites·20 claims
- 1254US5274914AMethod of producing surface package type semiconductor packageHITACHI LTD·Filed 1992·Granted Jan 4, 1994·19 cites·36 claims
- 1353US5803246ASurface package type semiconductor package and method of producing semiconductor memoryHITACHI LTD·Filed 1996·Granted Sep 8, 1998·10 cites·21 claims
- 1450US6223893B1Surface package type semiconductor package and method of producing semiconductor memoryHITACHI LTD·Filed 1999·Granted May 1, 2001·8 cites·20 claims
- 1549US2007235371A1Method for carrying a semiconductor deviceHITACHI TRANSPORT SYSTEM·Filed 2007·Application pending·0 cites
- 1642US5988368AResist pattern forming method using anti-reflective layer resist pattern formed and method of etching using resist pattern and product formedHITACHI LTD·Filed 1998·Granted Nov 23, 1999·5 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →