Inventor · disambiguated record
Wang Lai Lee
Also filed as: LEE WANG LAI
6 granted patents·1 pending application·95 citations·filing 2005–2025
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0197US7557443B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 7, 2009·66 cites·42 claims
- 0293US8823159B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 2, 2014·12 cites·19 claims
- 0390US9640458B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted May 2, 2017·7 cites·14 claims
- 0484US8507318B2Method for manufacturing microelectronic devicesYE SENG KIM DALSON·Filed 2009·Granted Aug 13, 2013·9 cites·21 claims
- 0574US10431513B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 1, 2019·1 cites·14 claims
- 0664US11239128B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
- 0750US2025336836A1Semiconductor package having auxiliary substrateMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →