Inventor · disambiguated record
Wai Wai Lee
Also filed as: LEE WAI WAI
0 granted patents·4 pending applications·0 citations·filing 2022–2024
Files withNexperia BV4
Top patents by PatentIndex Score
4 records- 0153US2022246505A1Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2022·Application pending·0 cites
- 0245US2023411175A1Method for manufacturing a semiconductor package assembly as well as such semiconductor package assemblyNexperia BV·Filed 2023·Application pending·0 cites
- 0344US2025183118A1Semi-conductor deviceNexperia BV·Filed 2024·Application pending·0 cites
- 0438US2023402355A1Electronic package with heatsink and manufacturing method thereforNexperia BV·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wai Wai Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →