Inventor · disambiguated record
Wai Ling Lee
Also filed as: LEE WAI LING
12 granted patents·2 pending applications·163 citations·filing 1998–2025
90Inventor score
Top patents by PatentIndex Score
14 records- 0196US11652026B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2022·Granted May 16, 2023·2 cites·20 claims
- 0295US10903142B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2019·Granted Jan 26, 2021·8 cites·22 claims
- 0390US6442634B2System and method for interrupt command queuing and orderingIBM·Filed 2001·Granted Aug 27, 2002·59 cites·8 claims
- 0490US2025385161A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2025·Application pending·0 cites
- 0588US2024429131A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2024·Application pending·0 cites
- 0684US12112997B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0783US12080628B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0881US11398415B2Stacked through-silicon vias for multi-device packagesINTEL CORP·Filed 2019·Granted Jul 26, 2022·3 cites·18 claims
- 0981US11393758B2Power delivery for embedded interconnect bridge devices and methodsINTEL CORP·Filed 2019·Granted Jul 19, 2022·3 cites·13 claims
- 1078US6279064B1System and method for loading commands to a bus, directly loading selective commands while queuing and strictly ordering other commandsIBM·Filed 2000·Granted Aug 21, 2001·22 cites·9 claims
- 1177US6065088ASystem and method for interrupt command queuing and orderingIBM·Filed 1998·Granted May 16, 2000·63 cites·9 claims
- 1276US9978735B2Interconnection of an embedded dieALTERA CORP·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 1375US11393741B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2021·Granted Jul 19, 2022·0 cites·11 claims
- 1439US9842181B1Method to optimize general-purpose input/output interface pad assignments for integrated circuitALTERA CORP·Filed 2016·Granted Dec 12, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →