Inventor · disambiguated record
Wangsun Lim
Also filed as: LIM WANGSUN
1 granted patent·1 pending application·0 citations·filing 2022–2023
5Inventor score
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0146US12414297B2Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0245US2024266307A1Method of fabricating semiconductor package and semiconductor package structure including the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →