Inventor · disambiguated record
Wan-Ting Lo
Also filed as: LO WAN-TING
9 granted patents·6 pending applications·341 citations·filing 2001–2023
89Inventor score
Files withBENQ MATERIALS CORP8LUXON ENERGY DEVICES CORP4TAIWAN SEMICONDUCTOR MFG CO LTD2LIH REN SHIUE1
Top patents by PatentIndex Score
15 records- 0191US6762926B1Supercapacitor with high energy densityLUXON ENERGY DEVICES CORP·Filed 2003·Granted Jul 13, 2004·113 cites·20 claims
- 0290US6510043B1Cylindrical high voltage supercapacitor having two separatorsLUXON ENERGY DEVICES CORP·Filed 2002·Granted Jan 21, 2003·67 cites·15 claims
- 0386US6462935B1Replaceable flow-through capacitors for removing charged species from liquidsLIH REN SHIUE·Filed 2001·Granted Oct 8, 2002·116 cites·18 claims
- 0477US6579327B1Cylindrical high voltage supercapacitor and method of manufacturing the sameLUXON ENERGY DEVICES CORP·Filed 2002·Granted Jun 17, 2003·24 cites·14 claims
- 0573US11616273B2Method for manufacturing a separatorBENQ MATERIALS CORP·Filed 2022·Granted Mar 28, 2023·0 cites·13 claims
- 0673US6680548B2Electronic timers using supercapacitorsLUXON ENERGY DEVICES CORP·Filed 2001·Granted Jan 20, 2004·20 cites·16 claims
- 0764US11575180B2Separator and method for manufacturing thereofBENQ MATERIALS CORP·Filed 2021·Granted Feb 7, 2023·0 cites·8 claims
- 0863US2025055135A1Separator and a method for manufacturing thereofBENQ MATERIALS CORP·Filed 2023·Application pending·0 cites
- 0963US2025055130A1Low thermal shrinkage separator and a method for manufacturing thereofBENQ MATERIALS CORP·Filed 2023·Application pending·0 cites
- 1063US2025055127A1Low thermal shrinkage separator and a method for manufacturing thereofBENQ MATERIALS CORP·Filed 2023·Application pending·0 cites
- 1162US10515172B2RC tool accuracy time reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·1 cites·20 claims
- 1257US2024234946A1High thermal-stability separator and method for manufacturing thereofBENQ MATERIALS CORP·Filed 2023·Application pending·0 cites
- 1356US10922464B2RC tool accuracy time reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 1456US2025055136A1SeparatorBENQ MATERIALS CORP·Filed 2023·Application pending·0 cites
- 1556US2025055142A1High tensile strength separatorBENQ MATERIALS CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →