Inventor · disambiguated record
Walter Hans Paul Schroen
Also filed as: SCHROEN WALTER H · SCHROEN WALTER HANS PAUL
8 granted patents·2 pending applications·263 citations·filing 1974–2019
86Inventor score
Files withTEXAS INSTRUMENTS INC9
Top patents by PatentIndex Score
10 records- 0194US3983264AMetal-semiconductor ohmic contacts and methods of fabricationTEXAS INSTRUMENTS INC·Filed 1974·Granted Sep 28, 1976·80 cites·15 claims
- 0291US6303977B1Fully hermetic semiconductor chip, including sealed edge sidesTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 16, 2001·150 cites·12 claims
- 0373US10438936B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 8, 2019·1 cites·5 claims
- 0465US6407333B1Wafer level packagingTEXAS INSTRUMENTS INC·Filed 1997·Granted Jun 18, 2002·27 cites·6 claims
- 0562US11177246B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 0656US9859261B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 2, 2018·0 cites·6 claims
- 0754US6998297B2Wafer level packagingTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 14, 2006·5 cites·8 claims
- 0853US9640519B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2015·Granted May 2, 2017·0 cites·6 claims
- 0947US2011112606A1Semiconductor System Integrated With Through Silicon Vias for Nerve RegenerationTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 1036US2001039078A1Wafer level packagingFiled 2000·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Walter Hans Paul Schroen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →