Inventor · disambiguated record
Wayne Anthony Sozansky
Also filed as: SOZANSKY WAYNE A · SOZANSKY WAYNE ANTHONY
6 granted patents·3 pending applications·208 citations·filing 1994–2022
85Inventor score
Files withDELCO ELECTRONICS CORP4SOZANSKY WAYNE A2BRANDENBURG SCOTT D1DELCO ELECTRONICS CORPORATINON1DELPHI TECH IP LTD1
Top patents by PatentIndex Score
9 records- 0181US5461008AMethod of preventing aluminum bond pad corrosion during dicing of integrated circuit wafersDELCO ELECTRONICS CORPORATINON·Filed 1994·Granted Oct 24, 1995·60 cites·8 claims
- 0278US5953814AProcess for producing flip chip circuit board assembly exhibiting enhanced reliabilityDELCO ELECTRONICS CORP·Filed 1998·Granted Sep 21, 1999·87 cites·14 claims
- 0370US5545915ASemiconductor device having field limiting ring and a process thereforDELCO ELECTRONICS CORP·Filed 1995·Granted Aug 13, 1996·38 cites·13 claims
- 0458US11961670B1System including a bent capacitor bus barDELPHI TECH IP LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 0547US6045032AMethod of preventing solder reflow of electrical components during wave solderingDELCO ELECTRONICS CORP·Filed 1998·Granted Apr 4, 2000·17 cites·20 claims
- 0642US2008310115A1Metal screen and adhesive composite thermal interfaceBRANDENBURG SCOTT D·Filed 2007·Application pending·0 cites
- 0741US2012168208A1System and method of forming a mechanical support for an electronic component attached to a circuit boardSOZANSKY WAYNE A·Filed 2010·Application pending·0 cites
- 0841US2008307643A1Method of assembly to achieve thermal bondline with minimal lead bendingSOZANSKY WAYNE A·Filed 2007·Application pending·0 cites
- 0936US5672528AMethod for making semiconductor device having field limiting ringDELCO ELECTRONICS CORP·Filed 1996·Granted Sep 30, 1997·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →