Inventor · disambiguated record
Wang Zhe
Also filed as: ZHE WANG
12 granted patents·570 citations·filing 2004–2010
93Inventor score
Top patents by PatentIndex Score
12 records- 0197US7436054B2MEMS microphone with a stacked PCB package and method of producing the sameSILICON MATRIX PTE LTD·Filed 2006·Granted Oct 14, 2008·127 cites·25 claims
- 0297US7202552B2MEMS package using flexible substrates, and method thereofSILICON MATRIX PTE LTD·Filed 2005·Granted Apr 10, 2007·137 cites·31 claims
- 0394US7692288B2MEMS packaging method for enhanced EMI immunity using flexible substratesSILICON MATRIX PTE LTD·Filed 2006·Granted Apr 6, 2010·39 cites·9 claims
- 0493US8178936B2Double-side mountable MEMS packageZHE WANG·Filed 2010·Granted May 15, 2012·45 cites·38 claims
- 0592US7843021B2Double-side mountable MEMS packageSHANDONG GETTOP ACOUSTIC CO·Filed 2008·Granted Nov 30, 2010·30 cites·42 claims
- 0691US7346178B2Backplateless silicon microphoneSILICON MATRIX PTE LTD·Filed 2004·Granted Mar 18, 2008·68 cites·53 claims
- 0790US7329933B2Silicon microphone with softly constrained diaphragmSILICON MATRIX PTE LTD·Filed 2004·Granted Feb 12, 2008·68 cites·11 claims
- 0889US8045734B2Backplateless silicon microphoneSHANDONG GETTOP ACOUSTIC CO·Filed 2008·Granted Oct 25, 2011·22 cites·20 claims
- 0988US8045733B2Silicon microphone with enhanced impact proof structure using bonding wiresSHANDONG GETTOP ACOUSTIC CO·Filed 2007·Granted Oct 25, 2011·24 cites·25 claims
- 1066US8467559B2Silicon microphone without dedicated backplateZHE WANG·Filed 2008·Granted Jun 18, 2013·4 cites·22 claims
- 1166US8013404B2Folded lead-frame packages for MEMS devicesSHANDONG GETTOP ACOUSTIC CO·Filed 2008·Granted Sep 6, 2011·4 cites·16 claims
- 1256US7999201B2MEMS G-switch deviceSHANDONG GETTOP ACOUSTIC CO·Filed 2008·Granted Aug 16, 2011·2 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →