Inventor · disambiguated record
Wen-Yuan Chang
Also filed as: CHANG WEN-YUAN
41 granted patents·11 pending applications·298 citations·filing 2000–2024
97Inventor score
Files withVIA TECH INC23CHANG WEN YUAN11VIA ALLIANCE SEMICONDUCTOR CO LTD5TRANSPACIFIC IP LTD4AU OPTRONICS CORP3
Top patents by PatentIndex Score
52 records- 0197US7372169B2Arrangement of conductive pads on grid array package and on circuit boardVIA TECH INC·Filed 2005·Granted May 13, 2008·66 cites·18 claims
- 0294US10504847B2Chip package structure and chip package structure arraySHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Dec 10, 2019·14 cites·22 claims
- 0393US7579612B2Resistive memory device having enhanced resist ratio and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 25, 2009·34 cites·14 claims
- 0490US9418964B2Chip package structureCHANG WEN-YUAN·Filed 2012·Granted Aug 16, 2016·13 cites·18 claims
- 0587US7170162B2Chip embedded package structureVIA TECH INC·Filed 2004·Granted Jan 30, 2007·39 cites·19 claims
- 0686US7342692B2Scanner carrierTRANSPACIFIC IP LTD·Filed 2005·Granted Mar 11, 2008·8 cites·19 claims
- 0782US7405103B2Process for fabricating chip embedded package structureVIA TECH INC·Filed 2005·Granted Jul 29, 2008·9 cites·16 claims
- 0879US6586844B1Flip chip dieVIA TECH INC·Filed 2002·Granted Jul 1, 2003·27 cites·5 claims
- 0978US10184956B2Probe cardVIA TECH INC·Filed 2018·Granted Jan 22, 2019·1 cites·6 claims
- 1078US7586188B2Chip package and coreless package substrate thereofVIA TECH INC·Filed 2006·Granted Sep 8, 2009·8 cites·16 claims
- 1174US9905519B1Electronic structure processVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 27, 2018·2 cites·14 claims
- 1272US6798075B2Grid array packaged integrated circuitVIA TECH INC·Filed 2002·Granted Sep 28, 2004·22 cites·18 claims
- 1371US7868439B2Chip package and substrate thereofVIA TECH INC·Filed 2006·Granted Jan 11, 2011·5 cites·20 claims
- 1471US7609524B2Package structure for panel module and method using the sameAU OPTRONICS CORP·Filed 2006·Granted Oct 27, 2009·6 cites·5 claims
- 1570US8508024B2Chip package structure and package substrateCHANG WEN-YUAN·Filed 2010·Granted Aug 13, 2013·3 cites·15 claims
- 1670US7906377B2Fabrication method of circuit boardVIA TECH INC·Filed 2009·Granted Mar 15, 2011·3 cites·5 claims
- 1769US9425066B2Circuit substrateVIA TECH INC·Filed 2012·Granted Aug 23, 2016·2 cites·18 claims
- 1866US10459007B2Probe cardVIA TECH INC·Filed 2018·Granted Oct 29, 2019·0 cites·5 claims
- 1964US9324580B2Process for fabricating a circuit substrateVIA TECH INC·Filed 2015·Granted Apr 26, 2016·1 cites·8 claims
- 2064US7225925B2Shock absorbent packaging structureAU OPTRONICS CORP·Filed 2004·Granted Jun 5, 2007·15 cites·18 claims
- 2163US8698325B2Integrated circuit package and physical layer interface arrangementCHANG WEN-YUAN·Filed 2011·Granted Apr 15, 2014·2 cites·17 claims
- 2263US2025149431A1Manufacturing method of electronic package and electronic packageVIA TECH INC·Filed 2024·Application pending·0 cites
- 2360US6947186B2Scanner carrierTRANSPACIFIC IP LTD·Filed 2001·Granted Sep 20, 2005·3 cites·7 claims
- 2459US7253526B2Semiconductor packaging substrate and method of producing the sameVIA TECH INC·Filed 2005·Granted Aug 7, 2007·1 cites·10 claims
- 2559US2024421124A1Manufacturing method of electronic package and electronic packageVIA TECH INC·Filed 2023·Application pending·0 cites
- 2659US2024421096A1Manufacturing method of electronic package and electronic packageVIA TECH INC·Filed 2023·Application pending·0 cites
- 2757US7289250B2[Operating method and changer for optical module/printer module system]TRANSPACIFIC IP LTD·Filed 2003·Granted Oct 30, 2007·2 cites·45 claims
- 2856US10119995B2Probe cardVIA TECH INC·Filed 2014·Granted Nov 6, 2018·0 cites·2 claims
- 2956US8602207B2Conveyor-belt linking apparatus of metallurgical furnaceCHANG WEN YUAN·Filed 2011·Granted Dec 10, 2013·2 cites·34 claims
- 3056US7505181B2Operating method and changer for optical module/printer module systemCHANG WEN-YUAN·Filed 2007·Granted Mar 17, 2009·0 cites·17 claims
- 3155US6946738B2Semiconductor packaging substrate and method of producing the sameVIA TECH INC·Filed 2002·Granted Sep 20, 2005·5 cites·8 claims
- 3254US7225985B2Optical scannerCHANG WEN-YUAN·Filed 2003·Granted Jun 5, 2007·1 cites·17 claims
- 3354US6650444B1Apparatus compensating a scanned object for optical characteristics according to light sources of different wavelengthsUMAX DATA SYSTEMS INC·Filed 2000·Granted Nov 18, 2003·1 cites·17 claims
- 3453USRE42710EApparatus compensating a scanned object for optical characteristics according to light sources of different wavelengthsTRANSPACIFIC SYSTEMS LLC·Filed 2005·Granted Sep 20, 2011·0 cites·31 claims
- 3553US2006283951A1Optical scannerTRANSPACIFIC IP LTD·Filed 2006·Application pending·0 cites
- 3652US8796848B2Circuit board and chip package structureCHANG WEN-YUAN·Filed 2011·Granted Aug 5, 2014·0 cites·15 claims
- 3751US12506060B2Package substrate, chip package and integrated circuit chipVIA TECH INC·Filed 2022·Granted Dec 23, 2025·0 cites·25 claims
- 3851US2009296330A1Electronic apparatusVIA TECH INC·Filed 2009·Application pending·0 cites
- 3948US6479891B2Incorrect-placement preventing directional IC tray for carrying IC packagesVIA TECH INC·Filed 2001·Granted Nov 12, 2002·2 cites·20 claims
- 4047US2013055764A1Crystal growth furnace and moving method thereofCHANG WEN-YUAN·Filed 2011·Application pending·0 cites
- 4147US2013020745A1Automatic continuous feeding device of metallurgical furnaceCHANG WEN YUAN·Filed 2011·Application pending·0 cites
- 4245US10002839B2Electronic structure, and electronic structure arrayVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·21 claims
- 4344US7504726B2Chip and manufacturing method and application thereofVIA TECH INC·Filed 2006·Granted Mar 17, 2009·0 cites·14 claims
- 4444US6515362B2Grid array package with increased electrical grounding routes and method of fabricationVIA TECH INC·Filed 2002·Granted Feb 4, 2003·1 cites·8 claims
- 4544US2013043108A1Conveyor-belt cooling apparatus of metallurgical furnaceCHANG WEN YUAN·Filed 2011·Application pending·0 cites
- 4642US2004183213A1Semiconductor packaging substrate and method of producing the sameFiled 2004·Application pending·0 cites
- 4741US10756077B2Chip packaging methodSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 25, 2020·0 cites·11 claims
- 4841US2011215019A1Package Box ModuleAU OPTRONICS CORP·Filed 2010·Application pending·0 cites
- 4941US2013009349A1Separation type metallurgical reduction method and apparatus thereofCHANG WEN YUAN·Filed 2011·Application pending·0 cites
- 5038US11081371B2Chip package processVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 3, 2021·0 cites·11 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →