Inventor · disambiguated record
Wei-Teng Chang
Also filed as: CHANG WEI · CHANG WEI-TENG
4 granted patents·4 pending applications·11 citations·filing 2006–2025
67Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5CHI MEI ENERGY CORP1HONEYWELL INT INC1RICHTEK TECHNOLOGY CORP1
Top patents by PatentIndex Score
8 records- 0186US10068830B2Compressible thermal interface materialsHONEYWELL INT INC·Filed 2015·Granted Sep 4, 2018·6 cites·20 claims
- 0280US2025349787A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0372US2024250055A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0471US2025316560A1Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0568US7840819B2Automatic switch method and apparatus for a USBRICHTEK TECHNOLOGY CORP·Filed 2006·Granted Nov 23, 2010·5 cites·4 claims
- 0665US11978715B2Structure and formation method of chip package with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 0761US12374600B2Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 0848US2011005566A1Photovoltaic cell module and method of making the sameCHI MEI ENERGY CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →