Inventor · disambiguated record
Wei-Ting Chen
Also filed as: CHEN WEI · CHEN WEI-TING
143 granted patents·61 pending applications·648 citations·filing 2000–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD70CHEN WEI TING12HARVARD COLLEGE11IND TECH RES INST8TECHWAY IND CO LTD7
Top patents by PatentIndex Score
204 records- 0199US10504835B1Package structure, semiconductor chip and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·64 cites·20 claims
- 0298US11456251B2Semiconductor structure, package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0398US11244939B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·7 cites·20 claims
- 0498US9939978B2Touch sensitive displaysAPPLE INC·Filed 2016·Granted Apr 10, 2018·15 cites·12 claims
- 0598US9553090B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 24, 2017·30 cites·20 claims
- 0697US9899271B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·17 cites·20 claims
- 0797US9559205B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 31, 2017·23 cites·20 claims
- 0896US9461043B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·11 cites·20 claims
- 0996US9450099B1Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·17 cites·20 claims
- 1095US10796990B2Semiconductor structure, package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·9 cites·20 claims
- 1195US10408416B2Achromatic metalens and metalens with reverse chromatic dispersionHARVARD COLLEGE·Filed 2018·Granted Sep 10, 2019·34 cites·16 claims
- 1294US11923315B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 1394US11874713B2Electronic deviceCHEN WEI TING·Filed 2022·Granted Jan 16, 2024·7 cites·21 claims
- 1493US11527486B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·2 cites·20 claims
- 1593US10937400B1Cable-driven beater mechanism for percussion instrumentRELIANCE INT CORP·Filed 2020·Granted Mar 2, 2021·4 cites·8 claims
- 1693US10510679B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·7 cites·20 claims
- 1793US10115685B2Method of manufacturing a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 30, 2018·6 cites·20 claims
- 1893US10074472B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 11, 2018·8 cites·20 claims
- 1993US9761488B2Method for cleaning via of interconnect structure of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 12, 2017·17 cites·23 claims
- 2093US7868727B2Inter-helix inductor devicesIND TECH RES INST·Filed 2008·Granted Jan 11, 2011·26 cites·9 claims
- 2192US10326005B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·4 cites·20 claims
- 2292US9536964B2Method for forming via profile of interconnect structure of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·12 cites·20 claims
- 2392US9460692B2Drum pedal and drum pedal unitRELIANCE INT CORP·Filed 2015·Granted Oct 4, 2016·10 cites·6 claims
- 2491US11205308B1Method and electronic apparatus of modifying three-dimensional modelXRSPACE CO LTD·Filed 2020·Granted Dec 21, 2021·6 cites·12 claims
- 2591US11092717B2Meta-lenses for sub-wavelength resolution imagingHARVARD COLLEGE·Filed 2017·Granted Aug 17, 2021·16 cites·23 claims
- 2691US10973144B2Electronic deviceLEE KUAN CHANG·Filed 2018·Granted Apr 6, 2021·17 cites·12 claims
- 2791US10634557B2Super-dispersive off-axis meta-lenses for high resolution compact spectroscopyHARVARD COLLEGE·Filed 2017·Granted Apr 28, 2020·8 cites·8 claims
- 2890US9953936B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·5 cites·14 claims
- 2990US9689202B2Roll control device for a vehicle curtainMACAUTO IND CO LTD·Filed 2015·Granted Jun 27, 2017·11 cites·17 claims
- 3090US9679850B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 13, 2017·5 cites·20 claims
- 3189US11242106B2Electric bike having improved effect of heat dissipationTECHWAY IND CO LTD·Filed 2019·Granted Feb 8, 2022·12 cites·2 claims
- 3289US10510714B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 3388US10867936B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 3488US10050013B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·5 cites·20 claims
- 3587US11835680B2Meta-lens doublet for aberration correctionHARVARD COLLEGE·Filed 2018·Granted Dec 5, 2023·7 cites·26 claims
- 3687US11194082B2Ultra-compact, aberration corrected, visible chiral spectrometer with meta-lensesHARVARD COLLEGE·Filed 2017·Granted Dec 7, 2021·7 cites·18 claims
- 3787US9736930B2Flexible electronic moduleIND TECH RES INST·Filed 2014·Granted Aug 15, 2017·6 cites·15 claims
- 3886US10686059B2Structure of semiconductor device structure having finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 16, 2020·2 cites·18 claims
- 3986US2025355339A1Extreme Ultraviolet (EUV) Mask and Method of Fabrication ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4085US11854928B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·20 claims
- 4185US11410923B2Semiconductor device, integrated fan-out package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 9, 2022·4 cites·20 claims
- 4285US10128203B2Fan-out package structure, antenna system and associated methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·4 cites·18 claims
- 4385US6518954B1Sensitive and short height pointing deviceDARFON ELECTRONICS CORP·Filed 2000·Granted Feb 11, 2003·43 cites·7 claims
- 4484US12489062B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 4583US11713843B2Stand adjustment deviceRELIANCE INT CORP·Filed 2021·Granted Aug 1, 2023·2 cites·8 claims
- 4682US11976776B2Stand adjustment deviceRELIANCE INT CORP·Filed 2023·Granted May 7, 2024·1 cites·8 claims
- 4782US11211358B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 4882US10621946B2Monitor, display device thereof, and monitoring systemSHENZHEN MINDRAY BIOMEDICAL ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·4 cites·14 claims
- 4981US10847304B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·2 cites·20 claims
- 5081US2024357939A1Extreme environment capable structurally integral multilaminar deviceQORTEK INC·Filed 2024·Application pending·0 cites
Showing the top 50 of 204 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →