Inventor · disambiguated record
Weiming Chris Chen
Also filed as: CHEN WEIMING · CHEN WEIMING CHRIS
41 granted patents·20 pending applications·145 citations·filing 2008–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD28NIDEC TOSOK CORP9REMACRO TECH CO LTD6SHIN ZU SHING CO LTD5MAN WAH FURNITURE MFG SHENZHEN CO LTD4
Top patents by PatentIndex Score
61 records- 0197US11462418B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·5 cites·20 claims
- 0297US10319699B2Chip package having die structures of different heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·21 cites·20 claims
- 0396US11380611B2Chip-on-wafer structure with chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·4 cites·20 claims
- 0495US11484122B2Sofa armrest connection structure and sofa assemblyREMACRO TECH CO LTD·Filed 2020·Granted Nov 1, 2022·9 cites·9 claims
- 0592US10304800B2Packaging with substrates connected by conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·10 cites·20 claims
- 0692US9746097B1Solenoid of electromagnetic valveNIDEC TOSOK CORP·Filed 2017·Granted Aug 29, 2017·8 cites·10 claims
- 0791US10510722B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·5 cites·20 claims
- 0889US11164855B2Package structure with a heat dissipating element and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·6 cites·20 claims
- 0988US11406191B2Iron sofa frame structure, sofa and production method thereofREMACRO TECH CO LTD·Filed 2020·Granted Aug 9, 2022·3 cites·35 claims
- 1087US2025054879A1Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1186US2025349747A1Chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1285US7971321B2Hinge and an electronic device with the hingeSHIN ZU SHING CO LTD·Filed 2008·Granted Jul 5, 2011·12 cites·20 claims
- 1385US7954203B2Hinge and an electronic device with the hingeSHIN ZU SHING CO LTD·Filed 2008·Granted Jun 7, 2011·16 cites·20 claims
- 1484US11508696B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 22, 2022·2 cites·20 claims
- 1583US10515869B1Semiconductor package structure having a multi-thermal interface material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1683US2025266402A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1781US8302260B2Hinge assemblyCHEN WEI-CHUN·Filed 2009·Granted Nov 6, 2012·13 cites·13 claims
- 1879US7752711B1Hinge and an electronic device with the hingeSHIN ZU SHING CO LTD·Filed 2008·Granted Jul 13, 2010·11 cites·16 claims
- 1979US2024387198A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2079US2024363483A1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2178US12148719B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 2278US11728238B2Semiconductor package with heat dissipation films and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·2 cites·21 claims
- 2377US12322729B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 2477US12315786B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 2577US12062590B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 13, 2024·1 cites·20 claims
- 2677US2025273550A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2775US12400878B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2874US11069467B2Solenoid deviceNIDEC TOSOK CORP·Filed 2019·Granted Jul 20, 2021·2 cites·11 claims
- 2974US2024312898A1Chip-on-wafer structure with chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3073US10801605B2Pressure control deviceNIDEC TOSOK CORP·Filed 2019·Granted Oct 13, 2020·1 cites·10 claims
- 3172US11139282B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 5, 2021·2 cites·20 claims
- 3272US8011065B2Hinge and an electronic device with the hingeSHIN ZU SHING CO LTD·Filed 2008·Granted Sep 6, 2011·4 cites·20 claims
- 3371US7996959B2Hinge and an electronic device with the hingeSHIN ZU SHING CO LTD·Filed 2008·Granted Aug 16, 2011·5 cites·16 claims
- 3470US12446699B2Sofa seat frame, sofa base assembly, sofa and sofa production and assembly processREMACRO TECH CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·19 claims
- 3570US12027455B2Chip-on-wafer structure with Chiplet InterposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 3670US11996371B2Chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·19 claims
- 3769US2025261760A1Angle adjustment systemMAN WAH FURNITURE MFG SHENZHEN CO LTD·Filed 2025·Application pending·0 cites
- 3868US12327781B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 3968US2025248531A1Hook component and sofa backrest assemblyMAN WAH FURNITURE MFG SHENZHEN CO LTD·Filed 2025·Application pending·0 cites
- 4067US2025269578A1Joint components used for joining external componentMAN WAH FURNITURE MFG SHENZHEN CO LTD·Filed 2025·Application pending·0 cites
- 4167US2025248537A1Elastic component, connecting component, and sofa leg board assemblyMAN WAH FURNITURE MFG SHENZHEN CO LTD·Filed 2025·Application pending·0 cites
- 4265US11444038B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 4364US2022336321A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4460US11864657B2Sofa seat frame, sofa base assembly, sofa and sofa production and assembly processREMACRO TECH CO LTD·Filed 2020·Granted Jan 9, 2024·0 cites·16 claims
- 4560US2024421126A1Chip Singulation Assisted Structures and Methods for Improving Bonding Interface QualityAPPLE INC·Filed 2024·Application pending·0 cites
- 4658US12108069B1Method, apparatus, system, and electronic device for transmitting composite photo dataUGREEN GROUP LTD·Filed 2024·Granted Oct 1, 2024·0 cites·9 claims
- 4758US10515906B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 4853US2024164097A1Three-dimensional memory, fabricating method thereof and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 4952US11950700B2Sofa backrest connection structure and sofa assemblyREMACRO TECH CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·14 claims
- 5052US8305747B2Rotary hinge and a portable electronic device with the sameJHU RUEI-LIN·Filed 2010·Granted Nov 6, 2012·1 cites·9 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →