Inventor · disambiguated record
Wen-Chuan Chen
Also filed as: CHEN WEN · CHEN WEN-CHUAN
19 granted patents·19 pending applications·337 citations·filing 1999–2024
94Inventor score
Files withIND TECH RES INST5KINGPAK TECH INC4CHEN WEN-CHUAN3DELTA ELECTRONICS INC3FUTUREWEI TECHNOLOGIES INC2
Top patents by PatentIndex Score
38 records- 0190US6441496B1Structure of stacked integrated circuitsFiled 2001·Granted Aug 27, 2002·84 cites·6 claims
- 0287US6521881B2Stacked structure of an image sensor and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Feb 18, 2003·53 cites·15 claims
- 0386US6559539B2Stacked package structure of image sensorFiled 2001·Granted May 6, 2003·55 cites·10 claims
- 0483US10241496B2Multi-axis motor synchronization control system and method thereofIND TECH RES INST·Filed 2015·Granted Mar 26, 2019·4 cites·12 claims
- 0583US9664119B2Gas flow adjusting deviceCHEN WEN-CHUAN·Filed 2015·Granted May 30, 2017·3 cites·13 claims
- 0682US6627983B2Stacked package structure of image sensorFiled 2001·Granted Sep 30, 2003·43 cites·12 claims
- 0780US6646316B2Package structure of an image sensor and packagingKINGPAK TECH INC·Filed 2001·Granted Nov 11, 2003·35 cites·2 claims
- 0875US8861553B2Asynchronous master-slave serial communication system, data transmission method, and control module using the same thereofCHEN WEN-CHUAN·Filed 2011·Granted Oct 14, 2014·7 cites·29 claims
- 0973US6737720B2Packaging structure of image sensor and method for packaging the sameFiled 2001·Granted May 18, 2004·22 cites·11 claims
- 1068US2025114844A1Cutter moduleDARWIN PRECISIONS CORP·Filed 2024·Application pending·0 cites
- 1164US8293572B2Injection molding system and method of chip packageCHEN WEN-CHUAN·Filed 2011·Granted Oct 23, 2012·2 cites·24 claims
- 1256US6489572B2Substrate structure for an integrated circuit package and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Dec 3, 2002·8 cites·12 claims
- 1351US12427074B2Femoral lift apparatusUNITED ORTHOPEDIC CORP·Filed 2022·Granted Sep 30, 2025·0 cites·7 claims
- 1451US9819720B2System and method to correlate local media URIs between web browsersFUTUREWEI TECHNOLOGIES INC·Filed 2014·Granted Nov 14, 2017·0 cites·15 claims
- 1551US2025189993A1Control system and control method for flight vehicleIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1648US2015106837A1System and method to dynamically synchronize hierarchical hypermedia based on resource description framework (rdf)FUTUREWEI TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 1747US2011071636A1Displacement Leaf Spring and Artificial Intervertebral Disc Containing the SameUNIV NAT YANG MING·Filed 2009·Application pending·0 cites
- 1846US11950771B2Supporting hook structure for femoral surgeryUNITED ORTHOPEDIC CORP·Filed 2021·Granted Apr 9, 2024·0 cites·11 claims
- 1945US6565008B2Module card and a method for manufacturing the sameKINGPAK TECH INC·Filed 2000·Granted May 20, 2003·3 cites·10 claims
- 2045US6191543B1Integrated circuit for multiple-axis position controlIND TECH RES INST·Filed 1999·Granted Feb 20, 2001·16 cites·20 claims
- 2145US2010217389A1Graft attachment device for ligament reconstructionUNIV NAT YANG MING·Filed 2009·Application pending·0 cites
- 2244US2007014677A1PumpDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 2342US2007007840A1Centrifugal water pump having polar anisotropic magnetic ringDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 2441US2014143468A1Real-time sampling device and method thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2539US2006083643A1PumpDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 2636US8090455B2Motion control servo loop apparatusCHEN YING-MIN·Filed 2009·Granted Jan 3, 2012·0 cites·3 claims
- 2735US8421961B2Active device array substrate and fabrication method thereofTSENG WEN-HSIEN·Filed 2010·Granted Apr 16, 2013·0 cites·8 claims
- 2833US2002096782A1Package structure of an image sensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 2933US2002060287A1Structure of a photosensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 3032US2002043709A1Stackable integrated circuitFiled 2001·Application pending·0 cites
- 3131US2002096751A1Integrated circuit structure having an adhesive agent and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 3231US2002096729A1Stacked package structure of image sensorFiled 2001·Application pending·0 cites
- 3330US2002096763A1Packaging structure of image sensors and method for packaging the sameFiled 2001·Application pending·0 cites
- 3430US2002096766A1Package structure of integrated circuits and method for packaging the sameFiled 2001·Application pending·0 cites
- 3528US2002096754A1Stacked structure of integrated circuitsFiled 2001·Application pending·0 cites
- 3627US6460092B1Integrated circuit for distributed-type input/output controlIND TECH RES INST·Filed 1999·Granted Oct 1, 2002·2 cites·6 claims
- 3726US2002096761A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 3826US2002096762A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →