Inventor · disambiguated record
Wen-Fu Chou
Also filed as: CHOU WEN-FU
8 granted patents·2 pending applications·9 citations·filing 2010–2021
75Inventor score
Top patents by PatentIndex Score
10 records- 0186US11322437B2Flip chip interconnection and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted May 3, 2022·2 cites·19 claims
- 0281US8384492B2Coaxial line to microstrip connector having slots in the microstrip line for receiving an encircling metallic plateUNIV NAT TAIPEI TECHNOLOGY·Filed 2010·Granted Feb 26, 2013·7 cites·16 claims
- 0355US10999928B1Circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted May 4, 2021·0 cites·13 claims
- 0452US11309238B2Layout structure of a flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Apr 19, 2022·0 cites·16 claims
- 0549US11812554B2Layout structure of a flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Nov 7, 2023·0 cites·10 claims
- 0648US11581283B2Flip chip package and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted Feb 14, 2023·0 cites·17 claims
- 0745US10993319B1Chip package and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted Apr 27, 2021·0 cites·15 claims
- 0844US2021257287A1Chip package and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 0942US2021204401A1Flexible circuit board having a stiffening structureCHIPBOND TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 1034US11350518B2Method of attaching heat sinks to a circuit tapeCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted May 31, 2022·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →