Inventor · disambiguated record
Wen Chu
Also filed as: CHU WEN · CHU WEN-CHENG
7 granted patents·4 pending applications·22 citations·filing 2009–2018
78Inventor score
Top patents by PatentIndex Score
11 records- 0182US8003532B2Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal filmWIN SEMICONDUCTORS CORP·Filed 2010·Granted Aug 23, 2011·8 cites·6 claims
- 0278US9178007B1High breakdown voltage metal-insulator-metal capacitorWIN SEMICONDUCTORS CORP·Filed 2014·Granted Nov 3, 2015·6 cites·18 claims
- 0378US8497206B2Method of processing backside copper layer for semiconductor chipsHUA CHANG-HWANG·Filed 2010·Granted Jul 30, 2013·7 cites·22 claims
- 0471US10410979B2Structure for reducing compound semiconductor wafer distortionWIN SEMICONDUCTORS CORP·Filed 2018·Granted Sep 10, 2019·1 cites·33 claims
- 0550US10158212B1Structure for reducing compound semiconductor wafer distortionWIN SEMICONDUCTORS CORP·Filed 2017·Granted Dec 18, 2018·0 cites·13 claims
- 0645US2011071430A1Biopsy Device and Method ThereofUNIV NAT YANG MING·Filed 2009·Application pending·0 cites
- 0738US2013277845A1Structure of backside copper metallization for semiconductor devices and a fabrication method thereofCHEN JASON·Filed 2012·Application pending·0 cites
- 0836US2018366417A1Structure for reducing compound semiconductor wafer distortionWIN SEMICONDUCTORS CORP·Filed 2017·Application pending·0 cites
- 0935US9548276B2Structure of backside copper metallization for semiconductor devices and a fabrication method thereofWIN SEMICONDUCTORS CORP·Filed 2015·Granted Jan 17, 2017·0 cites·14 claims
- 1034US2013207266A1Copper Interconnect for III-V Compound Semiconductor DevicesHUA CHANG-HWANG·Filed 2012·Application pending·0 cites
- 1133US8911551B2Electroless plating apparatus and methodCHEN JASON·Filed 2011·Granted Dec 16, 2014·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →