Inventor · disambiguated record
Wen Yuan Chuang
Also filed as: CHUANG WEN YUAN
1 granted patent·8 pending applications·1 citations·filing 2004–2023
15Inventor score
Top patents by PatentIndex Score
9 records- 0170US11244909B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 8, 2022·1 cites·15 claims
- 0252US2025132235A1Semiconductor device with surrounding bump metallization and method thereforNXP USA INC·Filed 2023·Application pending·0 cites
- 0350US2024413192A1Isolation structureNXP BV·Filed 2023·Application pending·0 cites
- 0449US2024339426A1Leadless semiconductor package with dual-sided stud structure for die-to-package fan outNXP BV·Filed 2023·Application pending·0 cites
- 0549US2025174507A1Semiconductor device having embedded die and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0645US2023326821A1Five-side mold protection for semiconductor packagesNXP BV·Filed 2022·Application pending·0 cites
- 0744US2024014123A1Semiconductor device with lead-on-chip interconnect and method thereforNXP BV·Filed 2022·Application pending·0 cites
- 0832US2008123321A1Backlight unitHSU HUNG-HUEI·Filed 2007·Application pending·0 cites
- 0927US2006121356A1Electrolyte for rechargeable batteryEXA ENERGY TECHNOLOGY CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →