Inventor · disambiguated record
Wei-Ping Dow
Also filed as: DOW WEI-PING
5 granted patents·4 pending applications·28 citations·filing 2004–2019
68Inventor score
Files withUNIV NAT CHUNG HSING5ROCKWOOD ELECTROCHEMICALS ASIA2EBARA UDYLITE KK1NAT UNIV CHUNG HSING1
Top patents by PatentIndex Score
9 records- 0192US9105696B1Method of coating surface of substrate hole with layer of reduced graphene oxideNAT UNIV CHUNG HSING·Filed 2014·Granted Aug 11, 2015·28 cites·15 claims
- 0266US11008665B2Method for manufacturing copper foil with rough surface in plating tank and its productUNIV NAT CHUNG HSING·Filed 2019·Granted May 18, 2021·0 cites·3 claims
- 0355US11252816B2Composite with hollow nano-structures and application thereofUNIV NAT CHUNG HSING·Filed 2019·Granted Feb 15, 2022·0 cites·14 claims
- 0452US10465056B2Method for producing flexible conductive substrate with high transmittance and product thereofUNIV NAT CHUNG HSING·Filed 2017·Granted Nov 5, 2019·0 cites·19 claims
- 0547US2008087549A1Additive For Copper Plating And Process For Producing Electronic Circiut Substrate TherewithEBARA UDYLITE KK·Filed 2004·Application pending·0 cites
- 0642US2018355499A1Manufacturing method of ultra-large copper grains without heat treatmentUNIV NAT CHUNG HSING·Filed 2018·Application pending·0 cites
- 0738US10543510B2Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGOUNIV NAT CHUNG HSING·Filed 2017·Granted Jan 28, 2020·0 cites·10 claims
- 0838US2007215479A1Method for monitoring the filling performance of copper plating formula for microvia fillingROCKWOOD ELECTROCHEMICALS ASIA·Filed 2006·Application pending·0 cites
- 0938US2007215490A1Method of analyzing accelerator for copper electroplatingROCKWOOD ELECTROCHEMICALS ASIA·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →