Inventor · disambiguated record
Wenchao Du
Also filed as: DU WENCHAO
1 granted patent·2 pending applications·0 citations·filing 2018–2023
4Inventor score
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3 records- 0157US2025108568A1Systems and methods for concurrent reaction-bonded joining and densificationUCHICAGO ARGONNE LLC·Filed 2023·Application pending·0 cites
- 0249US12208573B2Depowdering of additively manufactured objects with small and/or complex internal geometriesUCHICAGO ARGONNE LLC·Filed 2020·Granted Jan 28, 2025·0 cites·21 claims
- 0341US2019111585A1Hierarchical compositions for the additive manufacturing of materialsTEXAS A & M UNIV SYS·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →