Inventor · disambiguated record
Wendy Eng
Also filed as: ENG WENDY
2 granted patents·1 pending application·14 citations·filing 1998–2000
60Inventor score
Technology areasH10W
Files withCLEAR LOGIC INC2
Top patents by PatentIndex Score
3 records- 0137US6239480B1Modified lead frame for improved parallelism of a die to packageCLEAR LOGIC INC·Filed 1998·Granted May 29, 2001·7 cites·12 claims
- 0237US6235556B1Method of improving parallelism of a die to package using a modified lead frameCLEAR LOGIC INC·Filed 1998·Granted May 22, 2001·7 cites·10 claims
- 0333US2001000210A1Method of improving parallelism of a die to package using a modified lead frameFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →