Inventor · disambiguated record
Wei Gao
Also filed as: GAO WEI · GAO WEI ALFRED
15 granted patents·7 pending applications·138 citations·filing 2007–2024
91Inventor score
Files withFREESCALE SEMICONDUCTOR INC5SARTORIUS STEDIM BIOTECH GMBH4CALIFORNIA INST OF TECHN3BOSTON SCIENT SCIMED INC2GAO WEI2
Top patents by PatentIndex Score
22 records- 0195US9721881B1Apparatus and methods for multi-die packagingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 1, 2017·14 cites·20 claims
- 0291US10507278B2Fluidic devices, methods, and systemsBOSTON SCIENT SCIMED INC·Filed 2016·Granted Dec 17, 2019·75 cites·17 claims
- 0390US8329509B2Packaging process to create wettable lead flank during board assemblyGONG ZHIWEI·Filed 2010·Granted Dec 11, 2012·21 cites·20 claims
- 0487US11045566B2Sterile packaging unit and method for producing sameSARTORIUS STEDIM BIOTECH GMBH·Filed 2016·Granted Jun 29, 2021·4 cites·9 claims
- 0586US9362211B1Exposed pad integrated circuit package with mold lockFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·7 cites·19 claims
- 0681US10083912B2Method of packaging integrated circuit die and deviceFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Sep 25, 2018·4 cites·17 claims
- 0780US2024366117A1Systems and methods for powering autonomous sweat sensorCALIFORNIA INST OF TECHN·Filed 2024·Application pending·0 cites
- 0878US11433172B2Fluidic devices, methods, and systemsBOSTON SCIENT SCIMED INC·Filed 2019·Granted Sep 6, 2022·3 cites·20 claims
- 0974US11576988B2Sterile packaging unit and method for producing sameSARTORIUS STEDIM BIOTECH GMBH·Filed 2021·Granted Feb 14, 2023·0 cites·4 claims
- 1074US9142434B2Method for singulating electronic components from a substrateGAO WEI·Filed 2008·Granted Sep 22, 2015·4 cites·7 claims
- 1170US11542464B2Single use probe sterilizable by irradiation and method for the quality assurance of a single use probeSARTORIUS STEDIM BIOTECH GMBH·Filed 2017·Granted Jan 3, 2023·1 cites·16 claims
- 1269US10068841B2Apparatus and methods for multi-die packagingNXP USA INC·Filed 2017·Granted Sep 4, 2018·1 cites·20 claims
- 1368US10994276B2Temperature control device, use and arrangementSARTORIUS STEDIM BIOTECH GMBH·Filed 2014·Granted May 4, 2021·2 cites·13 claims
- 1466US8735223B2Semiconductor devices and methods of assembling sameGAO WEI·Filed 2012·Granted May 27, 2014·2 cites·15 claims
- 1557US2024403120A1Resource management systems and methods thereofZHEJIANG DAHUA TECHNOLOGY CO·Filed 2024·Application pending·0 cites
- 1654US2024403030A1Methods and systems for application deploymentZHEJIANG DAHUA TECHNOLOGY CO·Filed 2024·Application pending·0 cites
- 1749US2023181096A1Systems and methods for powering autonomous sweat sensorCALIFORNIA INST OF TECHN·Filed 2022·Application pending·0 cites
- 1845US2020397523A1Image-guided microrobotic methods, systems, and devicesCALIFORNIA INST OF TECHN·Filed 2020·Application pending·0 cites
- 1944US9034697B2Apparatus and methods for quad flat no lead packagingGONG ZHIWEI·Filed 2011·Granted May 19, 2015·0 cites·10 claims
- 2043US2008029860A1Semiconductor device with internal heat sinkFREESCALE SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 2143US2008283980A1Lead frame for semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 2241US10283477B2Method of fabricating 3-dimensional fan-out structureNXP USA INC·Filed 2016·Granted May 7, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →