Inventor · disambiguated record
Wei Gong
Also filed as: GONG WEI · Gong wei-ping
14 granted patents·9 pending applications·43 citations·filing 1993–2025
88Inventor score
Files withYang nai-lin5NEXPERIA TECH SHANGHAI LTD3UNIV CARNEGIE MELLON3INTEL CORP2SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO LTD2
Top patents by PatentIndex Score
23 records- 0184US10971423B2Metal nanowire based thermal interface materialsUNIV CARNEGIE MELLON·Filed 2019·Granted Apr 6, 2021·4 cites·15 claims
- 0282US8737051B2Display seal for electronic deviceYang nai-lin·Filed 2011·Granted May 27, 2014·9 cites·9 claims
- 0376US8511663B2Screen installation deviceGONG WEI·Filed 2011·Granted Aug 20, 2013·6 cites·20 claims
- 0475US8787029B2Button module and electronic deviceYang nai-lin·Filed 2011·Granted Jul 22, 2014·5 cites·11 claims
- 0574US2023234344A1Vehicle interior part and heated mould compression forming process thereofWUXI GISSING AUTO ACOUSTIC PARTS TECH CO LTD·Filed 2023·Application pending·0 cites
- 0667US11933549B2Nanowire-based thermal interfaceUNIV CARNEGIE MELLON·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 0765US11493288B2Nanowire-based thermal interfaceUNIV CARNEGIE MELLON·Filed 2020·Granted Nov 8, 2022·0 cites·17 claims
- 0863US2022009211A1Vehicle interior part and heated mould compression forming process thereofWUXI GISSING AUTO ACOUSTIC PARTS TECH CO LTD·Filed 2020·Application pending·0 cites
- 0958US12336144B2Immersed liquid-cooling server and waste heat recovery system thereofSUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1057US12277089B1Arm server and starting method and apparatus therefor, and readable storage mediumSUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1157US2025309030A1Microelectronic structures including ihs coupling enhancement structures for thermal degradation mitigationINTEL CORP·Filed 2024·Application pending·0 cites
- 1256US6565673B1Sm(Co, Fe, Cu, Zr, C) compositions and methods of producing sameSANTOKU CORP·Filed 1999·Granted May 20, 2003·14 cites·15 claims
- 1356US2025306312A1Photonic integrated circuit packages including a barrier material to confine a thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 1452US2025118607A1Substrate for power semiconductor packaging and a package containing such substrateNEXPERIA TECH SHANGHAI LTD·Filed 2024·Application pending·0 cites
- 1549US2025380614A1Piezoelectric Actuator and Moving DeviceYINGUAN SEMICONDUCTOR TECH CO LTD·Filed 2023·Application pending·0 cites
- 1648US12158021B2Three-dimensional isolator for vibration-seismic dual controlUNIV GUANGZHOU·Filed 2022·Granted Dec 3, 2024·0 cites·10 claims
- 1746US8047266B2Heat dissipation deviceFU ZHUN PRECISION IND SHENZHEN·Filed 2008·Granted Nov 1, 2011·0 cites·12 claims
- 1846US2023326907A1Package structure for power semiconductor devices with improved parasitic parametersNEXPERIA TECH SHANGHAI LTD·Filed 2023·Application pending·0 cites
- 1943US8830675B2Cover stopper structure and foldable electronic device using sameYang nai-lin·Filed 2012·Granted Sep 9, 2014·0 cites·11 claims
- 2041US8624112B2Shell assembly and assembly method thereofYang nai-lin·Filed 2011·Granted Jan 7, 2014·0 cites·10 claims
- 2140US2025247013A1Module for an electric circuit having a planarly stacked structure for power package terminals, as well as a related power module and method of manufacturing such a moduleNEXPERIA TECH SHANGHAI LTD·Filed 2025·Application pending·0 cites
- 2238US2012320631A1Cover and light guide plate for electronic deviceYang nai-lin·Filed 2011·Application pending·0 cites
- 2329US5403407APermanent magnets made from iron alloysUNIV DELAWARE·Filed 1993·Granted Apr 4, 1995·5 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →