Inventor · disambiguated record
Wei Hong
Also filed as: HONG WEI · Hong wei-ming
4 granted patents·2 pending applications·7 citations·filing 2014–2020
61Inventor score
Files withUNIV IOWA STATE RES FOUND INC2BASF SE1CHINA TRIUMPH INT ENG CO LTD1GLOBALFOUNDRIES US INC1PANJIT INT INC1
Top patents by PatentIndex Score
6 records- 0192US10823630B1High sensitivity MEMS pressure sensorUNIV IOWA STATE RES FOUND INC·Filed 2017·Granted Nov 3, 2020·7 cites·15 claims
- 0267US11506553B1High sensitivity MEMS pressure sensorUNIV IOWA STATE RES FOUND INC·Filed 2020·Granted Nov 22, 2022·0 cites·23 claims
- 0349US11171036B2Preventing dielectric void over trench isolation regionGLOBALFOUNDRIES US INC·Filed 2019·Granted Nov 9, 2021·0 cites·15 claims
- 0444US2015361208A1Hybrid latex comprising polymeric particles having core-shell structure and its preparation methodBASF SE·Filed 2014·Application pending·0 cites
- 0543US2022157707A1Thin semiconductor package and manufacturing method thereofPANJIT INT INC·Filed 2020·Application pending·0 cites
- 0634US10669187B2Pink aluminosilicate glassCHINA TRIUMPH INT ENG CO LTD·Filed 2015·Granted Jun 2, 2020·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →