Inventor · disambiguated record
Wei-Chung Hsiao
Also filed as: HSIAO WEI C · HSIAO WEI-CHUNG
34 granted patents·21 pending applications·80 citations·filing 2006–2023
95Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD21HWANG MING-HANG9GETAC TECHNOLOGY CORP7HSIAO WEI-CHUNG4MITAC TECHNOLOGY CORP4
Top patents by PatentIndex Score
55 records- 0196US10517192B2Bendable heat plateGETAC TECHNOLOGY CORP·Filed 2018·Granted Dec 24, 2019·10 cites·9 claims
- 0288US8517054B2Flow resistance deviceLAI JENG-MING·Filed 2010·Granted Aug 27, 2013·16 cites·18 claims
- 0381US8922999B2Heat dissipating assembly and elastic fastening member thereofLAI JENG-MING·Filed 2012·Granted Dec 30, 2014·10 cites·18 claims
- 0481US7397667B2Cooler module and its fastening structureCOMPAL ELECTRONICS INC·Filed 2007·Granted Jul 8, 2008·14 cites·14 claims
- 0579US8194147B2Image presentation angle adjustment method and camera device using the sameHSIAO WEI-CHUNG·Filed 2008·Granted Jun 5, 2012·7 cites·4 claims
- 0675US8162036B2Heat pipe structure and flattened heat pipe structureHSIAO WEI-CHUNG·Filed 2008·Granted Apr 24, 2012·5 cites·18 claims
- 0774US10025945B2Decryption method for use in displaying dataGETAC TECHNOLOGY CORP·Filed 2015·Granted Jul 17, 2018·2 cites·17 claims
- 0869US10939584B1Heat dissipation module and assembly method thereofGETAC TECHNOLOGY CORP·Filed 2019·Granted Mar 2, 2021·1 cites·13 claims
- 0969US10141266B2Method of fabricating semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Nov 27, 2018·1 cites·20 claims
- 1068US9490225B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·2 cites·20 claims
- 1168US7443675B2Heat pipe with guided internal grooves and heat dissipation module incorporating the sameMITAC TECHNOLOGY CORP·Filed 2006·Granted Oct 28, 2008·4 cites·11 claims
- 1267US9086862B2Apparatus and method of protecting electronic apparatus using a temperature-power table for an electronic component under different system and environmental temperaturesHSIAO WEI-CHUNG·Filed 2012·Granted Jul 21, 2015·2 cites·20 claims
- 1366US12442707B2Detection system and transient pressure response detection method for detecting residual air bubbles in liquid-cooling system and flow rate control device for using the sameWISTRON CORP·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 1465US12413833B2Vehicle cameraGETAC TECHNOLOGY CORP·Filed 2023·Granted Sep 9, 2025·0 cites·14 claims
- 1563US9716060B2Package structure with an embedded electronic component and method of fabricating the package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 25, 2017·1 cites·12 claims
- 1661US8743537B2Airflow adjustment device and blade serverYANG WEN-HSIUNG·Filed 2012·Granted Jun 3, 2014·1 cites·10 claims
- 1760US9673140B2Package structure having a laminated release layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·9 claims
- 1860US8796867B2Semiconductor package and fabrication method thereofHSIAO WEI CHUNG·Filed 2012·Granted Aug 5, 2014·1 cites·10 claims
- 1958US9026262B2Method, circuit, and electronic device for controlling rotation speed of fanWANG CHUN-CHI·Filed 2012·Granted May 5, 2015·1 cites·17 claims
- 2057US9510463B2Coreless packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·0 cites·9 claims
- 2154US7504148B2Printed circuit board structure and manufacturing method thereofMITAC TECHNOLOGY CORP·Filed 2006·Granted Mar 17, 2009·1 cites·3 claims
- 2253US9112063B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 2352US10068842B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 4, 2018·0 cites·13 claims
- 2452US10002825B2Method of fabricating package structure with an embedded electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·23 claims
- 2552US2016013123A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2651US10109572B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Oct 23, 2018·0 cites·14 claims
- 2751US9899249B2Fabrication method of coreless packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·10 claims
- 2850US9735080B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·8 claims
- 2949US10043757B2Semiconductor package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·10 claims
- 3049US9564390B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 7, 2017·0 cites·15 claims
- 3148US2017301658A1Fabrication method of package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 3248US2014057410A1Method of fabricating a packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 3346US10869007B2Event detecting and recording system, management method and activating method for information capturing deviceGETAC TECHNOLOGY CORP·Filed 2018·Granted Dec 15, 2020·0 cites·4 claims
- 3446US10096491B2Method of fabricating a packaging substrate including a carrier having two carrying portionsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 9, 2018·0 cites·5 claims
- 3545US2010246134A1Thermal insulation structureMITAC TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 3645US2007199682A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 3744US10332567B1Heat dissipation and shockproof structureGETAC TECHNOLOGY CORP·Filed 2018·Granted Jun 25, 2019·0 cites·20 claims
- 3844US2015333029A1Package substrate and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 3943US2007199681A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 4043US2008187407A1Fastening structure for reducing surface temperature of housingCOMPAL ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 4142US10462944B1Wave absorbing heat dissipation structureGETAC TECHNOLOGY CORP·Filed 2018·Granted Oct 29, 2019·0 cites·10 claims
- 4242US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4341US2007097645A1Heat pipe with expanded heat receiving section and heat dissipation moduleCHEN CHAO-YI·Filed 2006·Application pending·0 cites
- 4441US2015028485A1Substrate structure and semiconductor package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4539US2013026657A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 4635US7427807B2Chip heat dissipation structure and manufacturing methodMITAC TECHNOLOGY CORP·Filed 2006·Granted Sep 23, 2008·0 cites·18 claims
- 4735US2011170265A1Heat dissipating device and heat dissipating systemLAI JENG-MING·Filed 2010·Application pending·0 cites
- 4834US2013228921A1Substrate structure and fabrication method thereofHUNG LIANG-YI·Filed 2012·Application pending·0 cites
- 4933US2007201203A1Adhesion Material Structure and Process Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 5033US2007199678A1Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →