Inventor · disambiguated record

Wen-Chen Hsieh

Also filed as: HSIEH WEN-CHEN

2 granted patents·3 pending applications·2 citations·filing 2005–2025

40Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD5

Top patents by PatentIndex Score

5 records

0187US12154848B2Electronic package and manufacturing method thereof, and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 26, 2024·2 cites·8 claims
0268US2025038097A1Electronic package and manufacturing method thereof, and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0361US12278173B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
0457US2025201695A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
0532US2006076695A1Semiconductor package with flash-absorbing mechanism and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →