Inventor · disambiguated record
Wei-Ming Hsieh
Also filed as: HSIEH WEI-MING
3 granted patents·46 citations·filing 2017–2019
68Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0194US10037975B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 31, 2018·42 cites·18 claims
- 0283US10269771B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 0356US10879215B2Method for manufacturing a semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 29, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →