Inventor · disambiguated record
Wen-Kuo Hsieh
Also filed as: HSIEH WEN-KUO
14 granted patents·4 pending applications·560 citations·filing 2010–2025
92Inventor score
Top patents by PatentIndex Score
18 records- 0198US9754818B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·472 cites·20 claims
- 0297US9123656B1Organosilicate polymer mandrel for self-aligned double patterning processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 1, 2015·45 cites·20 claims
- 0396US9412648B1Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 9, 2016·13 cites·20 claims
- 0491US8470708B2Double patterning strategy for contact hole and trench in photolithographySHIH PO-CHENG·Filed 2010·Granted Jun 25, 2013·16 cites·20 claims
- 0586US10340178B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 2, 2019·2 cites·20 claims
- 0682US2025351559A1Transistor source/drain contacts and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0780US8361684B2Method for patterning trenches with varying dimensionTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·3 cites·20 claims
- 0879US10510584B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·1 cites·20 claims
- 0978US10141220B2Via patterning using multiple photo multiple etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·1 cites·20 claims
- 1074US8895445B2Method of forming via holesHSIEH WEN-KUO·Filed 2011·Granted Nov 25, 2014·5 cites·21 claims
- 1171US9728445B2Method for forming conducting via and damascene structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 8, 2017·2 cites·15 claims
- 1271US2023369325A1Transistor source/drain contacts and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1370US11798943B2Transistor source/drain contacts and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1460US11018021B2Curing photo resist for improving etching selectivityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 1554US9305839B2Curing photo resist for improving etching selectivityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 5, 2016·0 cites·20 claims
- 1652US10347505B2Curing photo resist for improving etching selectivityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 9, 2019·0 cites·20 claims
- 1750US2024120203A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1850US2024170339A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →