Inventor · disambiguated record

Wen-Rui Hsu

Also filed as: HSU WEN-RUI

2 granted patents·1 pending application·48 citations·filing 2001–2002

64Inventor score

Technology areasH10W

Files withAPACK COMM INC2

Top patents by PatentIndex Score

3 records

0171US6495915B1Flip chip package of monolithic microwave integrated circuitAPACK COMM INC·Filed 2001·Granted Dec 17, 2002·27 cites·14 claims
0268US6483186B1High power monolithic microwave integrated circuit packageAPACK COMM INC·Filed 2001·Granted Nov 19, 2002·21 cites·14 claims
0329US2003160322A1Monolithic microwave integrated circuit package having thermal viaFiled 2002·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Wen-Rui Hsu files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →