Inventor · disambiguated record
Wen-I Hsu
Also filed as: HSU WEN-I
34 granted patents·25 pending applications·106 citations·filing 2011–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD53TAIWAN SEMICONDUCTOR MFG3HSU WEN-I1SU CHING-CHUNG1TSENG HSIAO-HUI1
Top patents by PatentIndex Score
59 records- 0195US11011567B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·3 cites·20 claims
- 0295US9449914B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·21 cites·20 claims
- 0394US10269768B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·9 cites·20 claims
- 0494US10002899B2Microlens for a phase detection auto focus (PDAF) pixel of a composite grid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 19, 2018·15 cites·19 claims
- 0593US9871070B2Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·10 cites·20 claims
- 0692US9780137B2Mechanisms for forming image-sensor device with epitaxial isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 3, 2017·7 cites·22 claims
- 0791US9287312B2Imaging sensor structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·7 cites·20 claims
- 0890US11189743B2Single photon avalanche diodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·19 claims
- 0988US9059061B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 16, 2015·3 cites·20 claims
- 1087US8685820B2Multiple gate dielectric structures and methods of forming the sameTSENG HSIAO-HUI·Filed 2011·Granted Apr 1, 2014·8 cites·13 claims
- 1186US9905605B2Phase detection autofocus techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 27, 2018·5 cites·20 claims
- 1285US12482791B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 1385US10276622B2Mechanisms for forming image-sensor device with expitaxial isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·20 claims
- 1485US2025359383A1Pixel structures in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1584US10886320B2Mechanisms for forming image-sensor device with epitaxial isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 1683US10629568B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·2 cites·20 claims
- 1783US10163947B2Photodiode gate dielectric protection layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 1883US2025344542A1High performance stacking pixelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1983US2025344544A1Etch block structure for deep trench isolation recess containmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2082US9812477B2Photodiode gate dielectric protection layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·2 cites·20 claims
- 2181US9525003B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·2 cites·20 claims
- 2281US2025324799A1Dielectric structure for small pixel designsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2380US10629765B2Single photon avalanche diodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
- 2480US2025318304A1Isolation structure with multiple components to increase image sensor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2579US2025338045A1Stacked cmos image sensor comprising a pixel sensor for high conversion gain and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2678US2025348648A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2778US2025338600A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2877US2025143001A1High performance stacking pixelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2977US2025126912A1Semiconductor image-sensing structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3076US2025287121A1Integrated capacitor for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3176US2025006762A1Pixel Structures in Image SensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3275US2025344537A1Trapping film for deep trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3374US2024355860A1Etch block structure for deep trench isolation recess containmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3473US10868058B2Photodiode gate dielectric protection layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 3573US2025142232A1Stacked cmos image sensor comprising a pixel sensor for high conversion gain and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3672US2024021641A1Dielectric structure for small pixel designsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3771US12218164B2Semiconductor image-sensing structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 3871US11923338B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
- 3971US9147710B2Photodiode gate dielectric protection layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 29, 2015·0 cites·20 claims
- 4070US2025255024A1Trapping film for deep trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4170US2025344002A1Integrated capacitor for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4266US9673245B2Implant isolated devices and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 6, 2017·1 cites·20 claims
- 4366US9412781B2Photodiode gate dielectric protection layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 9, 2016·0 cites·20 claims
- 4466US9355888B2Implant isolated devices and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 31, 2016·1 cites·20 claims
- 4563US2023420464A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4663US2025393319A1Multiple conversion gain design for cmos image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4762US2022277127A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4861US2025261467A1Dual deep trench isolation structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4960US10535697B2Structure and method for 3D Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·0 cites·20 claims
- 5060US2025126915A1Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Wen-I Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →