Inventor · disambiguated record

Wei-Lung Hsu

Also filed as: HSU WEI LUNG

0 granted patents·2 pending applications·0 citations·filing 2008–2011

Technology areasH10W

Files withANO KAZUAKI1 YU FRANK1

Top patents by PatentIndex Score

2 records

0140US2009236715A1Semiconductor package structure with laminated interposing layerANO KAZUAKI·Filed 2008·Application pending·0 cites
0237US2012202300A1Die bonder including automatic bond line thickness measurementYU FRANK·Filed 2011·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Wei-Lung Hsu files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →